Semiconductor packaging shielding rubber material and shielding process thereof
A technology of semiconductor and rubber materials, which is applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc. Glue or overflow plating, improve quality, complete or highly masked effect on the masked surface
Inactive Publication Date: 2020-04-21
HIGH LINK ADVANCED TECH CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0004] In order to solve the problem that the tape used for masking is incomplete and prone to residual glue, which in turn affects the quality of semiconductor packaging, the present invention provides a semiconductor packaging masking compound, which includes:
Method used
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[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] Below in conjunction with accompanying drawing, the present invention is described in further detail:
[0027] A semiconductor encapsulation masking compound comprising:
[0028] Aliphatic urethane acrylate 45-60wt%;
[0029] 8-15wt% isobornyl acrylate; and
[0030] Microsphere foaming agent 9-20wt%;
[0031] 3-10wt% photoinitiator...
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Abstract
The invention discloses a semiconductor packaging shielding rubber material and a shielding process thereof. The process comprises the following steps of: dispensing / coating a local surface of a semiconductor package with the semiconductor package shielding glue material; carrying out light / heat curing on the semiconductor package shielding rubber material; sputtering a metal layer; foaming and stripping the semiconductor package shielding rubber material; and the like. The semiconductor packaging shielding rubber material does not foam at the sputtering temperature, and only foams in the foaming step to cause stripping of the rubber material. The semiconductor packaging rubber material in a colloid form is utilized to achieve a complete or highly shielding effect; the foaming process andthe microsphere foaming agent are matched, and because the microsphere foaming agent can rapidly expand and expand outwards in the foaming process, the semiconductor packaging rubber material can be completely stripped, the problem of residual rubber or overflow plating is solved, and the quality of the semiconductor packaging sputtering shielding face is effectively improved.
Description
technical field [0001] The invention relates to the technical field of rubber materials, in particular to a masking rubber material used in the electromagnetic protection process of semiconductor packaging and its masking process. Background technique [0002] After the semiconductor package is completed, in order to prevent the chip from being subjected to external radio frequency interference (radio frequency interference; RFI) or electromagnetic interference (electromagnetic interference; EMI), electromagnetic protection will be applied to the semiconductor package. The electromagnetic protection process is mainly around the semiconductor package. A metal film is formed by sputtering to achieve the effect of electromagnetic protection. [0003] In the above-mentioned electromagnetic protection process, before sputtering the metal film, the bottom of the semiconductor package (i.e., the IC substrate surface, IC Substrate) will be covered with a shielding material, no matte...
Claims
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IPC IPC(8): C09J175/14C09J11/06C09J5/08H01L23/29H01L23/552H01L21/56
CPCC09J5/08C09J11/06C09J175/14H01L21/56H01L23/295H01L23/552
Inventor 李瑞展谢雅雀
Owner HIGH LINK ADVANCED TECH CO LTD