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A vacuum packaging structure of an infrared detector with a coating

A technology of infrared detectors and vacuum packaging, which is applied in semiconductor devices, electric solid devices, semiconductor/solid device components, etc., can solve problems such as cracking and sealing failure, and achieve improved success rate, enhanced sealing effect, Labor saving effect

Active Publication Date: 2021-12-03
深圳南信国际电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a vacuum packaging structure for infrared detectors with a coating, to solve the above-mentioned background technology. And cut off the evacuated copper tube, there will be problems such as cracking and easy failure of the seal.

Method used

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  • A vacuum packaging structure of an infrared detector with a coating
  • A vacuum packaging structure of an infrared detector with a coating
  • A vacuum packaging structure of an infrared detector with a coating

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Embodiment Construction

[0032] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0033] See Figure 1-6 The present invention provides a technical solution: an infrared detector with a vacuum packaging structure of a plating layer, comprising a first horizontal plate 1 and the first vertical plate 2, on the right side surface of the first lateral plate 1 is connected by a threaded bolt with a first a vertical plate 2, a first vertical plate 2 by bolts and fixed to the first horizontal plate, a first vertical plate front end face of the bump processing 2, the ...

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Abstract

The invention discloses a vacuum packaging structure of an infrared detector with a coating, which includes a first horizontal plate and a first vertical plate, and the right side of the upper surface of the first horizontal plate is screwed with a first vertical plate through bolts. A bump is processed on the front end of the first vertical plate, and a fixing device is installed on the left side of the upper surface of the first horizontal plate. The infrared detector vacuum packaging structure with coating can realize the automatic cutting work through the mutual cooperation among the motor, gear, second connecting rod, arc rod, first connecting rod and slider, thus improving the efficiency of cutting. The success rate is high, saving labor. Through the mutual cooperation between the concave plate, the second vertical plate, the second spring, the second horizontal plate, the heating plate and the vacuum copper tube, the vacuum copper tube can be vacuumed by the electric heating plate. The tube is heated to melt the coating on its surface, which strengthens the sealing effect.

Description

Technical field [0001] The present invention relates to a vacuum packaging technologies, in particular vacuum packaging structure for an infrared detector with a coating. Background technique [0002] With the rapid development of technology in application of infrared, infrared instruments as a detector member, the reliability and stability of its performance has drawn increasing attention producer and the consumer, and the infrared detector in the vacuum packaging technology is playing processing applications more to the more important role, through infrared detector vacuum packaging technology led the rapid development of the production and processing package, although the prior art infrared detector vacuum packaging can be done, but in most cases manually by the cold pressing jaw and cutting brass vacuum, there will be occurred due to uneven force crack formed every seal prone to failure problems, while less reliable soldering and brazing the prior art at the communication, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/02H01L23/10
CPCH01L23/02H01L23/10
Inventor 不公告发明人
Owner 深圳南信国际电子有限公司
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