A foreign matter sorting and collecting device for a placement machine

Abstract

The invention discloses a foreign matter sorting and collecting device for a chip mounter, which includes a base one, a transmission mechanism is fixed on the top of the base one, and a storage tray is fixed on the top of the transmission mechanism. One side of the base one is fixed with a collection box, and the top of the collection box is fixed with a decontamination platform, and a feed trough is provided in the decontamination platform. The present invention can effectively screen and separate the leftovers doped in the components by means of mechanical vibration, and can also separate the leftovers of different sizes, which has stronger practicability and is different from the traditional manual sorting method. The sorting efficiency of the device has been significantly improved, which also saves a certain amount of labor costs on the other hand, and can reasonably air-dry the sorted components to accelerate the solidification of the adhesive at the joint surface, further improving the component bonding. The overall quality of chip processing is high, the degree of mechanization is high, and the operation is very easy to use.

Description

technical field [0001] The invention relates to the technical field of placement machines, in particular to a foreign matter sorting and collecting device for placement machines. Background technique [0002] The automatic placement machine is a device used to realize high-speed and high-precision automatic placement of components. It is the most critical and complex equipment in the entire SMT production. The placement machine is the main equipment in the SMT production line. The chip machine has developed from an early low-speed mechanical placement machine to a high-speed optical centering placement machine, and has developed into a multi-functional, flexible connection modularization. [0003] When the placement machine is working, it is necessary to place the components in the processing slot of the placement machine, and then use the mobile placement head to carry out placement processing on the components. After the placement process is completed, the components after...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings in the prior art, such as: during patch processing, corresponding patch scraps will be produced, and these scraps are mixed in the components after processing. First, it often takes a lot of manual time to select and separate them, which causes the overall work efficiency to not be improved, and the adhesive on the joint surface of the component that has just been placed is not completely solidified, so it can be directly inserted into the The next packaging will affect the subsequent normal use, and it needs to be air-dried

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