Screening method of high-reliability tantalum capacitor

Abstract

The invention discloses a screening method of a high-reliability tantalum capacitor. The screening method comprises the following steps that the capacitor is placed in a temperature impact box; the anode and cathode ends of the capacitor are connected with the output end of a power meter and the test end of a leakage current meter correspondingly; a certain direct current voltage is applied to thecapacitor; high and low temperature impact is performed on the capacitor through the temperature impact box when the direct current voltage is applied; a leakage current value is detected at low temperature / high temperature in the last temperature circulation process, and the capacitor exceeding a standard value is removed; and the leakage current value is detected at room temperature, and the capacitor exceeding a standard value is removed. According to the screening method of the high-reliability tantalum capacitor, the direct current voltage is applied to the capacitors under high-low temperature impact to perform high-low temperature voltage aging screening, the capacitors with poor temperature impact resistance are removed, and the capacitors with high temperature impact resistance are selected, so that the reliability of the qualified selected capacitors is ensured.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a screening method for high-reliability tantalum capacitors. Background technique [0002] Tantalum capacitors are widely used in consumer electronics, medical, military, aviation, aerospace and other fields due to their good stability, high reliability and low failure rate. Although tantalum capacitors have undergone a series of screenings such as reflow soldering, surge current, and high-temperature voltage aging at the manufacturer before shipment, there are still individual tantalum capacitors that have increased leakage current or breakdown failure during actual use. The main reason is that traditional screening methods cannot completely remove tantalum capacitors with potential defects. Traditional screening methods, such as reflow soldering, surge current, high-temperature voltage aging, etc., are to apply high-temperature stress to tantalum capacitors or apply electri...

AI Technical Summary

Problems solved by technology

Although tantalum capacitors have undergone a series of screenings such as reflow soldering, surge current, and high-temperature voltage aging at the manufacturer before shipment, there are still individual tantalum capacitors that have increased leakage current or breakdown failure during actual use. The main reason is that traditional screening methods cannot completely remove tantalum capacitors with potential defects

Traditional screening methods, such as reflow soldering, surge current, high-temperature voltage aging, etc., are to apply high-temperature stress to tantalum capacitors or apply electrical stress at high temperature and room temperature to remove defective tantalum capacitors, while applying at low temperature Tantalum capacitors that are defective in electrical stress or that exhibit electrical stress during temperature changes cannot be completely rejected

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