Vacuum high-low temperature semiconductor device test probe station

A test probe, high and low temperature technology, applied in the field of vacuum high and low temperature semiconductor device test probe station, can solve the problems of troublesome replacement, low replacement efficiency, and inaccurate measured results, etc. convenient effect

Active Publication Date: 2020-04-24
合肥芯测半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The existing vacuum high and low temperature semiconductor device test probe station is cumbersome to replace the probe, and the replacement efficiency is low, and when the probe is used to test the wafer, the surface of the wafer is easily scratched, which further affects the quality of the wafer. The test results cannot be accurate, which affects the normal judgment of the wafer. Therefore, we propose a vacuum high and low temperature semiconductor device test probe station to solve the above problems

Method used

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Embodiment Construction

[0023] Such as Figure 1-5 As shown, the embodiment of the present invention provides a vacuum high and low temperature semiconductor device test probe station, including a workbench body 1, a protective cover 3, a probe rod 7 and a probe head 8, and the center of the top surface of the workbench body 1 is opened There is a placement groove 2, and the workbench body 1 and the protective cover 3 are clamped. By setting the placement groove 2, the semiconductor device is placed inside the placement groove 2, so as to facilitate the positioning of the semiconductor device. The two ends of the top surface of the workbench body 1 Both are fixedly connected with a moving mechanism 4, and the two moving mechanisms 4 all include a moving box 401, and the sides of the two moving boxes 401 away from each other are fixedly connected with a micromotor 402, and the micromotor 402 of the present invention uses a 5LK60W micromotor. The output end of the motor 402 is fixedly connected with a ...

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Abstract

The invention provides a vacuum high-low temperature semiconductor device test probe station, which relates to the technical field of semiconductor devices. The vacuum high-low temperature semiconductor device test probe station comprises a workbench body, a protective cover, a probe rod and a probe head, wherein moving mechanisms are fixedly connected to the two ends of the top surface of the workbench body, each moving mechanism comprises a moving box, and micro motors are fixedly connected to the side surfaces, away from each other, of the two moving boxes. According to the vacuum high-lowtemperature semiconductor device test probe station provided by the invention, as a clamping mechanism is arranged, the advantages of convenience in replacement and use is achieved, and the problems that a probe is troublesome to replace when an existing vacuum high-low temperature semiconductor device test probe station is used for replacing the probe and the replacement efficiency is low can besolved; and as a buffer mechanism is arranged, the conditions that the surface of the wafer is easily stabbed, the testing of the wafer is further influenced, the tested result cannot be accurate andthe normal judgment of the wafer is influenced when the wafer is tested are effectively avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor devices, in particular to a vacuum high and low temperature semiconductor device testing probe station. Background technique [0002] Semiconductor devices usually use different semiconductor materials, different processes and geometric structures, and have developed a variety of crystal diodes with different functions and uses. The frequency coverage of crystal diodes can range from low frequency to high frequency. , microwave, millimeter wave, infrared until light wave, three-terminal devices are generally active devices, typical representatives are various transistors (also known as transistors). [0003] The existing vacuum high and low temperature semiconductor device test probe station is cumbersome to replace the probe, and the replacement efficiency is low, and when the probe is used to test the wafer, the surface of the wafer is easily scratched, which further affects the quality of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 刘家铭张孝仁苏华庭
Owner 合肥芯测半导体有限公司
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