Wafer horizontal deviation detection method, detection device and furnace tube equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing, and in particular relates to a wafer horizontal deviation detection method, a wafer horizontal deviation detection device and furnace tube equipment. The detection method comprises the steps of determining an excircle area of a reference wafer; calculating the minimum circumscribed rectangle of the excircle area of the reference wafer; determining a tangent point between the minimum circumscribed rectangle and the excircle area of the reference wafer; transferring the wafer to be measured to the outer circle area of the reference wafer; controlling a ray to enter from one side of the tangent point along the vertical direction; and judging whether the ray is received at the other side of the tangent point or not. The detection device comprises a CPU, a program storage part, a memory and a data bus, wherein the CPU, the program storage part and the memory are respectively connected with the data bus. A program is stored in the program storage part and is used for executing the detection method. The furnace tube equipment comprises a ray receiving and transmitting system, a wafer boat, a moving device, a moving driving system and a detection device. According to the invention, the offset vector of the wafer to be detected in the horizontal direction is detected through the ray, and the horizontal offset vector can be corrected in time according to the offset vector.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a furnace tube wafer level deviation detection method, a furnace tube wafer level deviation detection device and furnace tube equipment for detecting the wafer level deviation. Background technique [0002] The semiconductor manufacturing process is mainly to perform multiple photolithography processes, etching processes, and film forming processes, etc., to form semiconductor devices with various structures on the semiconductor wafer, and many of the processes must be carried out by furnace tube equipment. Taking the thermal oxygen method as an example, the reaction gas is first passed into the high-temperature furnace tube, so that the reaction gas undergoes a chemical reaction in the reaction chamber of the furnace tube equipment, and a thin film is deposited on the surface of the wafer, and then the wafer is removed from the reaction chamber. Take it out, ...

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Problems solved by technology

[0004] The present invention provides a wafer level deviation detection method, detection device and furnace tube equipment, which can solve the

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