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Ultra-small size double-sided adhesive tape cutting method

A size, ultra-small technology, applied in the field of ultra-small-size double-sided tape cutting, which can solve the problems of products that are easy to drop, shift, not suitable for mass production, and low product yield.

Active Publication Date: 2020-04-28
DONGGUAN LINGYI PRECISION MFG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the double-sided tape used in electronic products is very small, after cutting out the shape of the product directly, the product is easy to fall off, shift, have embossing, and there are knife marks on the tape. After the product is assembled, it is also easy to cause Product anti-release type
The yield rate of products produced by this process is low, and it is not suitable for mass production

Method used

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  • Ultra-small size double-sided adhesive tape cutting method
  • Ultra-small size double-sided adhesive tape cutting method
  • Ultra-small size double-sided adhesive tape cutting method

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Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0023] Figure 1 ~ Figure 4 Schematically shows an ultra-small size double-sided tape cutting method according to an embodiment of the present invention, comprising the following steps:

[0024] S1. Hollowing out with circular knife: First, apply the first low-membrane film on the non-release surface of the release film 1, use a round knife to cut and hollow out the release film 1 in the product area, and discharge the waste from the first low-membrane film.

[0025] While cutting, a half-cross positioning mark 11 is made on the non-product area of ​​the release film 1, which can facilitate the positioning and cutting in the subsequent processing process, prevent deviation from occurring, and ensure that the cutting position is accurate. When the round knife is hollowed out, it directly cuts through the release film 1 and the first lower mucous membrane. Whe...

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PUM

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Abstract

The invention discloses an ultra-small size double-sided adhesive tape cutting method, and belongs to the technical field of double-sided adhesive tape cutting. The method comprises the following steps of S1, hollowing out a product area of a release film through a circular knife, covering the lower surface of the release film with a low-viscosity film, and covering a release surface with a double-sided adhesive tape and a cover film; S2, cutting off waste materials in the X direction of the product area by adopting the circular knife, discharging hole waste and glue waste, under the knife, ofa lower-viscosity film, covering a high-viscosity film under a release film, and replacing with a new cover film; and S3, carrying out sleeve cutting by adopting an engraving die, half cutting all cutter lines to the high-viscosity film, discharging holes and edge waste under the high-viscosity film, discharging the outer frame waste and the cover film waste of the tape, and obtaining a final product. According to the method, a material belt in the product area is hollowed out firstly, and then the appearance of the product is cut out in two steps, so that it is guaranteed that the product isfree of displacement and sheet falling during waste discharge, the material belt is free of knife marks, and the reverse release phenomenon of the product is effectively avoided; and the manufacturedproduct is high in precision, the production yield is greatly improved, defects are reduced, and the method is suitable for mass production.

Description

Technical field [0001] The invention relates to the technical field of double-sided tape cutting, and in particular to a method for cutting ultra-small size double-sided tape. Background technique [0002] Double-sided tape is generally made of PET double-sided coated with propylene glycol. It has good dimensional stability, thermal stability, and chemical stability. It has good initial and long-lasting tack. It is easy to die-cut and process. It is suitable for plastics, rubber, and nameplates. It has good viscosity; can be applied to a wider temperature range and harsh environments; long-term temperature resistance is 100~120℃, and short-term temperature resistance can reach 140~200℃. Therefore, it is widely used in electronic products such as mobile phones, PADs, and LCD TVs. However, the glue of double-sided tape is fluid. During the processing, the product is prone to undesirable phenomena such as pieces falling off, glue overflow, back-adhesion, shifting, and reverse r...

Claims

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Application Information

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IPC IPC(8): B26F1/38B26F1/44
CPCB26F1/3866B26F1/44
Inventor 董川
Owner DONGGUAN LINGYI PRECISION MFG TECH CO LTD
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