A method for cutting ultra-small size double-sided adhesive tape

Abstract

The invention discloses a method for cutting ultra-small double-sided adhesive tape, which belongs to the technical field of double-sided adhesive tape cutting. The method comprises the following steps: S1. The product area of ​​the release film is hollowed out by a circular knife, and a low-adhesive film is covered under the release film, and double-sided adhesive tape and a cover film are covered on the release surface; S2. The product area is covered by a circular knife. The waste in the X direction is cut off, and the low-mum film is used to discharge the hole waste and glue waste under the knife, and the high-mum film is placed under the release film, and a new cover film is replaced; Mucous membrane, submucosal drainage hole and side waste, drained plastic outer frame waste and cover film waste to obtain the final product. The invention firstly hollows out the material tape in the product area, and then cuts out the product shape in two steps, which can ensure that the product waste does not shift, does not fall off, and the material tape has no knife marks, effectively solving the phenomenon of product reverse release; The products made have high precision, which also greatly improves the production yield, reduces defects, and is suitable for mass production.

Description

technical field [0001] The invention relates to the technical field of double-sided tape cutting, in particular to a method for cutting ultra-small double-sided tape. Background technique [0002] Double-sided adhesive is generally made of PET double-sided coated acrylic acid adhesive, which has good dimensional stability, thermal stability, chemical stability, good initial tack and stickiness, easy die-cutting processing, and is suitable for plastic, rubber, and nameplates. It has good viscosity; it can be applied to a wider temperature range and harsh environment; the long-term temperature resistance is 100-120°C, and the short-term temperature resistance can reach 140-200°C. Therefore, it is widely used in electronic products such as mobile phones, PADs, and LCD TVs. However, the glue of double-sided adhesive tape is fluid, and the product is prone to adverse phenomena such as chipping, overflowing glue, sticking back, shifting, and reverse release during processing. , c...

AI Technical Summary

Problems solved by technology

[0003] Since the double-sided tape used in electronic products is very small, after cutting out the shape of the product directly, the product is easy to fall off, shift, have embossing, and there are knife marks on the tape. After the product is assembled, it is also easy to cause Product anti-release type

The yield rate of products produced by this process is low, and it is not suitable for mass production

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