Novel uniform temperature liquid cold plate

Abstract

The invention discloses a novel uniform temperature liquid cold plate, and relates to the field of heat dissipation equipment. The novel uniform temperature liquid cooling plate comprises a uniform temperature heat conducting plate body; and the bottom of the uniform temperature heat conducting plate body is connected with a heating component, the uniform temperature heat conducting plate body isuniformly internally provided with a plurality of heat conducting columns, the uniform temperature heat conducting plate body is internally injected with a uniform temperature plate filling refrigerant, the top of the uniform temperature heat conducting plate body is connected with a cold plate cavity, the uniform temperature heat conducting plate body and the cold plate cavity is enclosed into aclosed space, the closed space is provided with a plurality of cooling fins, a liquid inlet and a liquid outlet communicate with the closed space, and cooling liquid is injected into the closed space.Through organic combination of the uniform temperature plate technology and the cold plate technology, free control of the temperature is achieved, at the same time, the temperature change rate is improved, and the economical practicability is high. The device is simple in structure, electric components is not needed, the cost is low, and the cooling speed is fast.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment, in particular to a novel uniform temperature liquid cooling plate. Background technique [0002] Vapor vapor chamber technology is similar to heat pipes in principle, but differs in conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, after absorbing the heat from the chip, the liquid at the bottom of the vacuum chamber evaporates and diffuses into the vacuum chamber, conducts the heat to the cooling fins, and then condenses into a liquid and returns to the bottom. This kind of evaporation and condensation process, which is similar to a refrigerator air conditioner, circulates rapidly in the vacuum chamber, achieving a very high heat dissipation efficiency. The organic combination of it and the cold plate technology makes the temperatur...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a new type uniform temperature liquid cold plate, to solve the problem of poor heat dissipation effect of the existing temperature uniform plate heat dissipation technology and cold plate technology proposed in the above background technology

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