Medium barrel

Abstract

The invention provides a medium barrel. The medium barrel comprises a barrel-shaped flow guide structure; the side wall of the barrel-shaped flow guide structure inclines or protrudes inwards, so thatgas flowing into the barrel-shaped flow guide structure can flow close to the inner wall of the barrel-shaped flow guide structure. According to the medium barrel provided by the invention, glow extinction phenomena can be reduced, the stability of plasmas is improved, and therefore, process results are improved.

Description

technical field [0001] The present invention relates to the technical field of semiconductor equipment, in particular to a medium cartridge. Background technique [0002] With the development of the manufacturing process of semiconductor components, the requirements for the performance and integration of components are getting higher and higher, which makes plasma technology widely used. In plasma-related processes, the distribution, density, and stability of the plasma are critical to process results. [0003] like figure 1 As shown, the commonly used dielectric cylinder includes a cylindrical secondary ceramic cylinder 11, the secondary ceramic cylinder 11 is provided with an edge gas inlet nozzle 12, and the surrounding of the secondary ceramic cylinder 11 is surrounded by an edge coil 13, when the etching or deposition gas enters through the edge After the gas nozzle 12 enters the auxiliary ceramic cylinder 11, the edge coil 13 is loaded with radio frequency power, and...

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Problems solved by technology

[0004] However, for the commonly used auxiliary ceramic cylinder 11, the gas entering from the edge air inlet nozzle 12 will hit the wall of the auxiliary ceramic cylinder 11, forming an S-shaped air flow (As shown in area a in Figure 1), so that The gas moves closer to the center at the bottom of the auxiliary ceramic cylinder 11, away from the inner wall of the auxiliary ceramic cylinder 11, so that the excitation distance of the edge coil 13 increases, which will cause excessive reflected power, and sometimes even trigger the protection device of the radio frequency power supply to work, that is , the protection device turns off the radio frequency power supply, and after the reflected power decreases, turn on the radio frequency power supply again, so that the plasma in the secondary ceramic cylinder 11 will be extinguished first, and then excited again, this phenomenon is called the extinction phenomenon, this Phenomena that affect the stability of the plasma and thus the process results

In addition, because the gas accumulates at the position of the auxiliary ceramic cylinder 11 corresponding to the edge coil 13, the flow rate of the gas here is relatively slow. It is impossible to quickly replace the gas before switching, so that various gases will be mixed at the bottom of the auxiliary ceramic cylinder 11. Due to the large change in the mixing ratio of various gases, the impedance will be unstable, which will also cause the reflected power to be too large. extinction phenomenon

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