Infrared detector and its forming method, infrared detector packaging structure and its method

An infrared detector and packaging structure technology, applied in the field of sensing, can solve problems such as low efficiency and high cost, and achieve the effects of improving production efficiency, reducing process costs, and reducing packaging costs
CN111092126BActive Publication Date: 2021-12-10ZHEJIANG DALI TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
ZHEJIANG DALI TECH
Publication Date
2021-12-10

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Abstract

The present invention relates to an infrared detector and its forming method, an infrared detector packaging structure and its forming method. The infrared detector includes: a detector including a substrate, and the substrate has a first surface and a second surface opposite to each other. A sensing circuit is formed on the first surface; a base, the base surface has a depression, the bottom surface of the depression is a curved surface, and the position of the depression corresponds to the sensing circuit; the detector is fixed on the base surface, the second surface of the substrate is in contact with the bottom surface of the depression, so that the sensing surface of the detector is a curved surface. The infrared detector has a relatively low cost.
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Description

technical field

[0001] The invention relates to the field of sensing technology, in particular to an infrared detector and a forming method thereof, an infrared detector packaging structure and a packaging method thereof. Background technique

[0002] Infrared imaging technology is widely used in military, industrial, agricultural, medical, forest fire prevention, environmental protection and other fields, and its core component is the infrared focal plane array (IRFPA). According to the working principle, it can be divided into: cooled infrared detector and uncooled infrared detector.

[0003] Refrigerated detectors mainly use the narrow-bandgap semiconductor photoelectric effect to convert infrared light signals into electrical signals, also known as photon detectors, and usually work at 77K or lower temperatures, which requires bulky and expensive refrigeration equipment. In addition, materials such as HgCdTe and InSb used to make photon detectors are expensive, difficul...

Claims

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