43results about How to "Compact package" patented technology

The invention provides a light source packaging structure, and a positioning and coupling method thereof. The light source packaging structure comprises a sealing box cover (101), a C lens (102), a silicon based heat sink (103), a laser chip (104), an isolator assembly (106), and a silicon light chip (107). The laser chip (104), a collimating lens (105), and the isolator assembly (106) are sequentially disposed on the silicon based heat sink (103). The C lens (102) is aligned with the grating coupler (110) of the silicon light chip (107) in a fixed and coupled manner. The sealed box cover (101) is provided with an inclined inner wall used to reflect light emitted by the laser chip (104) to the C lens, and the lower surface of the C lens (102) is provided with a polishing surface matched with the incident angle of the reflected light. The side of the C lens (102) inclined toward the direction away from the silicon based heat sink (103), and the optical axis of the C lens (102) is consistent with the transmission direction of the light, and the main light is superposed with the optical axis. A coupling structure is compact, and position tolerance is large.

The invention discloses a ceramic packaging device of a semiconductor laser. The device comprises an L-shaped anode soldering lug, an L-shaped cathode soldering lug and a semiconductor laser chip, wherein the L-shaped anode soldering lug is attached onto two adjacent surfaces of a heat sink carrier to form an L shape; the L-shaped cathode soldering lug and the L-shaped anode soldering lug are adjacent and parallel, and are attached onto two adjacent surfaces of the heat sink carrier to form another L shape; the semiconductor laser chip is adhered onto the top of one side of the L-shaped cathode soldering lug through a soldering material, and an anode of the semiconductor laser chip is bonded to one side of the L-shaped anode soldering lug with a soldering wire; and an anode soldering pad and a cathode soldering pad, positioned on one side of the bottom surface of the heat sink carrier, of the L-shaped anode soldering lug and the L-shaped cathode soldering lug are directly welded with a circuit board. The device is applicable to packaging of pulse type semiconductor lasers with small power, the dimensions of devices can be compressed to a greater extent, and meanwhile a more effective heat dissipation environment is provided.

The present invention relates to the field of chip packaging and in particular to a TSV-based multi-chip package structure and a method for fabricating the same. The multi-chip package structure comprises an interconnection structure; a first chip disposed on the interconnection structure; an adapter plate disposed on the interconnection structure at the same side as well as the first chip, and having a thickness greater than that of the first chip; a second chip disposed on the adapter plate and opposite to the interconnection structure; and a packaging layer. By means of the interconnectionstructure and the adapter plate which has a certain thickness and on which the second chip is mounted, the first chip and the second chip can be located on two planes at different heights, thereby realizing the three-dimensional package of the multiple chips. Compared with the prior art, the package structure provided by the present invention has the size sum of the first chip and the second chipno longer limited by the plan view size of the interconnection structure, thereby expanding the diversified development of the chip packaging structure.

The invention belongs to the technical field of laser manufacturing, and aims to provide a multi-single tube large-power semiconductor laser package structure and a laser. The package structure comprises a base shell, wherein a package groove is formed in the base shell, a plurality of first steps are arranged at a central region of the groove bottom of the package groove and are integratedly formed along an X-axis direction so as to achieve integrated design of the package shell, the material cost and the production cost; and moreover, the height of a step surface of each step along a Z-axisdirection is sequentially and gradually reduced along a positive direction of an X axis, two groups of COS assemblies are arranged on the step surface of the corresponding step in a back-to-back way,and light emitted from each light-emitting unit is converted to collimating parallel light, gathered in the package groove and then is introduced to a light path coupling assembly outside the packagegroove for focusing and coupling. Apparently, the laser forms a new light path and electrical-thermal-mechanical balance, the volume is greatly reduced, concentrated heat dissipation is beneficial forcontrolling the integral temperature, light beam subsequent coupling is small in influence on the light-emitting unit, the output power of the laser is large, and the laser is more stable in performance.

The invention relates to a high-heat-dispersion reverse solder spherical array encapsulation method which comprises the following steps of: implanting a chip into a substrate by using a binding material; pasting a spring radiator on the chip; electrically connecting the chip and the substrate by a metal lead; plastically encapsulating the spring radiator, the chip, the metal lead, the binding material and the substrate with a plastic encapsulating material to form a plastic encapsulated body; and fixing the periphery of the spring radiator by the plastic encapsulating material, wherein one end of the spring radiator is connected with the chip, and the other end is exposed out of the surface of the encapsulated body so that the heat of the chip is dispersed out of the encapsulated body. The invention solves the problems of heat dispersion in encapsulation without an exposed metal carrier plates and greatly improves the electrothermal performance and the reliability of the product.

The invention relates to a flip-chip high-heat-radiation spheroidal array encapsulation structure, which comprises a chip, an electric interconnection material, a lower filling material, a base plate, a plastic sealing material and a welding ball. A spring heat radiator is also arranged in the encapsulation structure. The electric interconnection material is planted on the front side of the chip, and is inversely arranged on the base plate, and the electric interconnection between the chip and the base plate is realized through the electric interconnection material, the lower filing material fills a gap between the chip and the base plate, the plastic sealing material plastically seals the spring heat radiator, the chip, the electric interconnection material, the lower filling material and the base plate for forming a plastic sealing body, the circumambience of the spring heat radiator is fixed by the plastic sealing material, one end of the spring heat radiator is connected with the chip, and the other end of the spring heat radiator is exposed on the surface of the plastic sealing body for radiating the heat of the chip out of the plastic sealing body. The problem of heat radiation of the encapsulation of carrying bases or inversely arranged chips without exposed metals is solved, and the electric heating performance and the reliability of the products are greatly improved.

A touch sensor using a Hall IC is provided. To this end, in a cantilever mechanism 15 of a parallel link by two plate springs 16, a coupling member 18 on the fixed side is fixed to a supporting block 24 which penetrates through the center of a plate spring 16 on a lower side and uprightly provided on a pedestal 22. A movable portion 28 on the free end side is a lightweight coupling member 19 provided by bend-processing an aluminum thin plate, to which a rare-earth magnet 25 is adhered. An elastic part 20a of a Hall IC supporting member 20 is fixed to the coupling member 18 on the fixed side, and a rigid part 20b with a rib 17a is supported by an adjusting rod 36 to fine-adjust relative position of a Hall IC 26 provided on the free end with respect to the magnet 25. Elastic wire materials 38s are fixed to the Hall IC supporting members 20s which hold at a free end 38b the self-weight of the movable portion 28, and abutted with a lower surface 40a of a bush on the inner surface of a housing 12, so that the movable portion 28 is stabilized in its position. A light load of 0.6 gf or less activates an anvil 34, and the Hall IC 26 detects a minute displacement of 0.1 mm or less of the magnet 25, in order to light up a signal light 14.

The invention discloses a detachable polymer lithium ion battery. The detachable polymer lithium ion battery comprises at least two parallel polymer lithium ion battery cells, and an upper stainless steel sheet, a lower stainless steel sheet, a top shell and a bottom shell which are connected fixedly to form a cell containing cavity, wherein the two sides and the bottoms of the upper stainless steel sheet and the lower stainless steel sheet are inwards bent respectively to form side connection edges and inserting teeth; inserting grooves corresponding to the inserting teeth are formed in the bottom shell; the tops of the upper stainless steel sheet and the lower stainless steel sheet are in injection molding connection with the top shell; and the lap joint parts of the side connection edges on the two sides of the upper stainless steel sheet and the lower stainless steel sheet are welded together. The invention provides a cell packaging structure which has high packaging precision and maximized capacity density and low cost; the two or more than two polymer cells are overlapped and connected in parallel and are welded, and then are welded on a protection plate; and a battery shell packaging structure is combined by a plastic shell and a metal shell and the packaging size is saved, so that the battery packaging structure is more compact.

The invention relates to an encapsulation structure for an MEMS (micro-electromechanical system) variable optical attenuator. The encapsulation structure comprises a focusing lens, a tail fiber sleeve and an optical chip, wherein the optical chip is manufactured by adopting the MEMS, the tail fiber sleeve is fixedly arranged in a hollow cylindrical magnet through bonding glue for forming a magnetic assembly 1, one end of the focusing lens is a light signal incident surface, the other end of the focusing lens is provided with a light reflecting surface, the focusing lens is fixedly arranged in the other hollow cylindrical magnet through bonding agents, the optical chip is fixedly arranged on the end part, used for being sucked with the magnetic assembly 1, on the hollow cylindrical magnet through bonding agents, and a magnetic assembly 2 is formed; the magnetic assembly 1 and the magnetic assembly 2 which are in a mutual magnetic suction state and are reinforced through the bonding agents form a variable optical attenuator assembly, the optical attenuator assembly is arranged in a hollow external protecting sleeve, in addition, two ends of the external protecting sleeve are filled and encapsulated by bonding agents, and the variable optical attenuator is formed. The invention aims at providing the encapsulation structure and an encapsulation method for the MEMS with the advantages of miniaturization, low cost and high reliability.

The invention relates to an infrared detector and a forming method thereof, and an infrared detector packaging structure and a forming method thereof. The infrared detector comprises a detector and abase, wherein the detector comprises a substrate, the substrate is provided with a first surface and a second surface which are opposite to each other, a sensing circuit is formed on the first surface, the surface of the base is provided with a recess, a bottom surface of the recess is a curved surface, and the position of the recess corresponds to that of the sensing circuit, the detector is fixed on a surface of the base, and the second surface of the substrate is attached to the bottom surface of the recess, so a sensing surface of the detector is a curved surface. The infrared detector islow in cost.

The invention discloses a packing device of a split air conditioner and a method for packing the split air conditioner by using the packing device. The split air conditioner comprises an indoor unit, an outdoor unit and an installing attachment, wherein the installing attachment comprises a connecting copper pipe and a connecting cable, and the indoor unit, the outdoor unit and the installing attachment are arranged in one packing paper box together; the packing paper box is of an upper-down separating structure, and the packing paper box is fixedly bundled through more than two packing belts; the indoor unit is arranged on the upper part and the side surface of the outdoor unit, the front side, the rear side or the right side of the outdoor unit and a packing liner of the outdoor unit and the inner wall of the packing paper box can form a gap together, and the installing attachment is arranged in the gap; and the left and right end surfaces and the middle part of the indoor unit are all provided with upper packing liners matched with the shapes of the left and right end surfaces and the middle part of the indoor unit in the length direction. The packing device and the packing method disclosed by the invention have the characteristics that the structure is simple and reasonable, the volume of the complete machine is small, the rigidity is good, the strength is high, the operation is flexible, the fabricating cost is low, and the packing device is easy to pack.

The invention discloses a fiber bragg grating packaging structure and packaging method, and belongs to the technical field of fiber packaging, the fiber bragg grating packaging structure comprises a shell and further comprises: a fiber bragg grating assembly, wherein the fiber bragg grating assembly comprises a fixed sliding block, a movable sliding block and a fiber bragg grating, the two ends of the fiber bragg grating are fixedly connected to the fixed sliding block and the movable sliding block respectively, and the fixed sliding block is connected with one end of the shell; an elastic piece which is connected with one end of the movable sliding block; and an adjusting device, wherein one end of the adjusting device is connected to the shell, the other end of the adjusting device is connected with the other end of the movable sliding block, the position of the movable sliding block can be adjusted through the adjusting device, and therefore the stress of the fiber bragg grating is adjusted. The shell is provided with the fiber bragg grating assembly, the elastic piece and the adjusting device, the position of the movable sliding block is changed by adjusting the expansion degree of the elastic piece through the adjusting device, and therefore the tensioning degree of the fiber bragg grating connected between the movable sliding block and the fixed sliding block can be adjusted, and the stress of the fiber bragg grating can be adjusted.

The invention discloses an optical fiber power monitoring structure. The optical fiber power monitoring structure comprises an optical fiber and a photosensitive receiving element used for monitoringoptical signal energy or power; a fiber bragg grating forming an inclination angle with the light transmission direction is arranged in a fiber core of the optical fiber, and part of optical signals transmitted in the fiber core are reflected by the fiber bragg grating, then leaked out of a cladding of the optical fiber in the form of a radiation mode and received by the photosensitive receiving element. By utilizing the characteristics of the fiber bragg grating, power or energy of different wavelengths can be monitored, and the optical fiber power monitoring structure has the characteristicsof simple structure, low cost and the like.

The invention discloses a wafer level chip packaging structure and a corresponding packaging method. The wafer level chip packaging structure comprises a substrate and a chip, wherein the chip is inversely mounted on the surface of the substrate, and a closed cavity is formed between the functional surface of the chip and the substrate. According to the invention, the packaging structure can be formed on one substrate, the process is simple, the packaging size can be effectively reduced, the thickness can be reduced, and the air tightness of the whole structure can be effectively guaranteed.