Ceramic packaging device of semiconductor laser

Abstract

The invention discloses a ceramic packaging device of a semiconductor laser. The device comprises an L-shaped anode soldering lug, an L-shaped cathode soldering lug and a semiconductor laser chip, wherein the L-shaped anode soldering lug is attached onto two adjacent surfaces of a heat sink carrier to form an L shape; the L-shaped cathode soldering lug and the L-shaped anode soldering lug are adjacent and parallel, and are attached onto two adjacent surfaces of the heat sink carrier to form another L shape; the semiconductor laser chip is adhered onto the top of one side of the L-shaped cathode soldering lug through a soldering material, and an anode of the semiconductor laser chip is bonded to one side of the L-shaped anode soldering lug with a soldering wire; and an anode soldering pad and a cathode soldering pad, positioned on one side of the bottom surface of the heat sink carrier, of the L-shaped anode soldering lug and the L-shaped cathode soldering lug are directly welded with a circuit board. The device is applicable to packaging of pulse type semiconductor lasers with small power, the dimensions of devices can be compressed to a greater extent, and meanwhile a more effective heat dissipation environment is provided.

Description

technical field [0001] The present invention relates to the technical field of semiconductor lasers, in particular to a ceramic packaging device for semiconductor lasers. Background technique [0002] A semiconductor laser is a laser that uses semiconductor materials such as gallium arsenide (GaAs) and indium phosphide (InP) as the working substance, and its essence is a diode chip with optical feedback capability. Semiconductor lasers have the advantages of small size, long life, and simple external drive. They are the most practical and important type of lasers, and are widely used in laser radar, laser guidance, optical fiber communication and other fields. [0003] Conventional semiconductor lasers are mostly packaged with TO (transistor outline, transistor outline), and the package form includes a TO socket, a tongue, a pin and a cap. The tube tongue is connected to the tube base, the semiconductor laser chip is glued and solidified on the tube tongue, the negative ele...

AI Technical Summary

Problems solved by technology

However, in the above-mentioned prior art solutions, the size of the insulating ceramic between the base and the pins, the diameter and thickness of the base, and the height of the cap limit the reduction of the overall size of the TO package. The outer diameter of the existing TO18 package is 5.6mm, which is used in many It can no longer be used in occasions, and cannot meet the requirements of laser radar, optical fiber communication and other fields for further compression of the mechanical size and thickness of laser light sources

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