Encapsulation structure and encapsulation method for MEMS (micro-electromechanical system) variable optical attenuator

A technology of dimming attenuation and packaging structure, which is applied in the coupling of optical waveguides, etc., can solve the problems of lower yield and higher device cost, and achieve the effects of low cost, avoiding welding process, and convenient optical path adjustment

Active Publication Date: 2014-04-02
苏州盛维新电子科技有限公司
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Problems solved by technology

Metal welding leads to a substantial increase in the cost of the device, and also easily leads to a decrease in yield

Method used

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  • Encapsulation structure and encapsulation method for MEMS (micro-electromechanical system) variable optical attenuator
  • Encapsulation structure and encapsulation method for MEMS (micro-electromechanical system) variable optical attenuator
  • Encapsulation structure and encapsulation method for MEMS (micro-electromechanical system) variable optical attenuator

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Embodiment Construction

[0047] The present invention will be further described below in conjunction with specific embodiment:

[0048] Such as figure 1 , figure 2 ,and image 3 As shown, a package structure of a MEMS tunable optical attenuator includes a focusing lens 4, a pigtail tube 3 with an input optical fiber 31 and an output optical fiber 32, and an optical chip 5 made by a micro-electromechanical system. The focusing lens is a self-focusing lens. The pigtail sleeve with input optical fiber and output optical fiber is fixed in a hollow cylindrical magnet 11 with adhesive glue to form a magnetic assembly 1; one end of the self-focusing lens is an optical signal incident surface, and the other end has a light reflection surface 41, and the light of the self-focusing lens The converging point is located on the light reflecting surface 41; the self-focusing lens is fixed in another hollow cylindrical magnet 21 with adhesive; The upper end used to attract and engage with the magnetic assembly ...

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Abstract

The invention relates to an encapsulation structure for an MEMS (micro-electromechanical system) variable optical attenuator. The encapsulation structure comprises a focusing lens, a tail fiber sleeve and an optical chip, wherein the optical chip is manufactured by adopting the MEMS, the tail fiber sleeve is fixedly arranged in a hollow cylindrical magnet through bonding glue for forming a magnetic assembly 1, one end of the focusing lens is a light signal incident surface, the other end of the focusing lens is provided with a light reflecting surface, the focusing lens is fixedly arranged in the other hollow cylindrical magnet through bonding agents, the optical chip is fixedly arranged on the end part, used for being sucked with the magnetic assembly 1, on the hollow cylindrical magnet through bonding agents, and a magnetic assembly 2 is formed; the magnetic assembly 1 and the magnetic assembly 2 which are in a mutual magnetic suction state and are reinforced through the bonding agents form a variable optical attenuator assembly, the optical attenuator assembly is arranged in a hollow external protecting sleeve, in addition, two ends of the external protecting sleeve are filled and encapsulated by bonding agents, and the variable optical attenuator is formed. The invention aims at providing the encapsulation structure and an encapsulation method for the MEMS with the advantages of miniaturization, low cost and high reliability.

Description

technical field [0001] The invention relates to an optical attenuator, in particular to a packaging structure and a packaging method of a MEMS adjustable optical attenuator. Background technique [0002] With the rapid development of informatization and high-speed broadband networks, traditional communication networks are developing into high-speed, intelligent optical fiber communication networks. Therefore, miniaturized, dynamically adjustable and intelligent optical devices have become indispensable key devices in new optical communication networks. [0003] Variable Optical Attenuator, the main function of VOA in the optical communication network is to control the strength of the transmitted optical signal, especially with the dense wavelength division multiplexing DWDM transmission system, optical fiber amplifier EDFA and optical receiver in optical communication Widely used in the network, it must achieve gain flatness or power balance of each channel in multiple opti...

Claims

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Application Information

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IPC IPC(8): G02B6/26G02B6/32
Inventor 李四华李维杨忠钰施林伟
Owner 苏州盛维新电子科技有限公司
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