A preparation device and method for a large-scale heat-fit structure for carbon fiber filaments

Abstract

A preparation device and method for a large-scale heat-adaptive structure of carbon fiber filaments, comprising: a base, a fixing block, a pressing slide block, a pressure plate, carbon fiber filaments and screws. The pressure plate, the compression slider, the fixed block, and the base are fixedly connected in sequence, and a plurality of carbon fiber filaments are inserted between the compression slider and the fixed block, so that the cross-sectional shape of the carbon fiber filament is the same as that of the heat-fitting structure. The invention uses a metal mold to press and compress the carbon fiber, and the pressure can be adjusted so that the carbon fiber can be compressed without too much pressure to damage the carbon fiber. The structure is simple and the implementability is good.

Description

technical field [0001] The invention relates to a preparation device and method for a large-scale thermal adaptation structure of carbon fiber filaments, which belongs to the technical field of space camera large-area infrared focal plane structure, and particularly relates to a carbon fiber filament thermal adaptation applied to a large-scale infrared focal plane. A processing method and a manufacturing device for an adaptive structure. Background technique [0002] In order to obtain good imaging quality for space infrared remote sensing cameras, the area array detectors need to work in a cryogenic environment, and generally need to be cooled to 60-80K. Reduce the thermal resistance between the cold finger and the detector. The working temperature of the detector is 60 ~ 80K, but the temperature of its assembly environment, storage environment and non-working state is generally at room temperature. It can be seen that there is a temperature fluctuation of about 200K in th...

AI Technical Summary

Problems solved by technology

The working temperature of the detector is 60 ~ 80K, but the temperature of its assembly environment, storage environment and non-working state is generally at room temperature. It can be seen that there is a temperature fluctuation of about 200K in the environment where the detector and the carrier board assembly are located. When the temperature fluctuates, Inconsistencies in the linear expansion coefficients of the detector and the bearing plate and other structures will cause the detector to warp and deform, and in severe cases will cause the detector to be damaged

[0003] When the size of the detector is small (such as 320X256), the matching design of the linear expansion coefficient can be used to reduce the thermal deformation and warpage of the detector. The matching of expansion coefficients cannot completely eliminate thermal deformation, especially for detectors with large area arrays (such as 2560X2560), and the problem of detector warpage caused by thermal deformation appears again.

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