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Semiconductor laser whole aging device and aging method

An aging device and laser technology, which is applied in the direction of single semiconductor device testing, semiconductor working life testing, measuring devices, etc., can solve the problems of inapplicable laser aging, no design of heat dissipation device, and inability to use laser aging, so as to reduce heat dissipation in a timely manner. , the effect of avoiding direct contact, avoiding damage and contamination

Inactive Publication Date: 2020-05-08
潍坊华光光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this device cannot fix the packaged laser. At the same time, the device does not have a special heat dissipation device. It can only be used for the aging of the chip in the laser package, and it can only be used for aging alone. It cannot be used for the aging of the packaged laser. Cannot be used for the aging of the whole laser

Method used

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  • Semiconductor laser whole aging device and aging method
  • Semiconductor laser whole aging device and aging method
  • Semiconductor laser whole aging device and aging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] as attached figure 2 As shown, the left and right ends of the slot 13 are respectively provided with bell mouths 14 whose openings are larger than the width of the slot 13 . Since the bell mouth 14 has a relatively large opening, it is convenient for the mold strip 24 to be inserted into the slot 13 from the bell mouth 14 .

Embodiment 2

[0047] as attached figure 1 As shown, the pressing mechanism can be the following structure, which includes a support 6 arranged on the base 1, a mounting seat 7 installed on the upper end of the support 6, a lifting rod 5 slidingly installed in the mounting seat 7 in the vertical direction, and a pin Shaft I 9 is hingedly mounted on the handle 8 at the upper end of mounting base 7, the lower end of lifting rod 5 is connected to the upper end of circuit board 3, one end of connecting rod 10 is hingedly installed with lifting rod 5 through pin shaft II 11, and the other end is hinged through pin shaft III 12 is hingedly installed with handle 8. When the handle 8 is pressed down, the handle 8 drives the lifting rod 5 to move down along the mounting seat 7 through the connecting rod 10, and the lifting rod 5 drives the circuit board 3 to move down. When the handle 8 is pulled upward, the handle 8 drives the elevating rod 5 to move up along the mounting seat 7 through the connect...

Embodiment 3

[0049] It also includes guide rods 4 vertically arranged at the left and right ends of the base 1, and the left and right ends of the fixed plate 2 are respectively provided with sliding holes I 17 matching the guide rods 4, and the fixed plate 2 is slid and inserted on the same side through the sliding holes I 17 On the corresponding guide rod 4 , the left and right ends of the circuit board 3 are respectively provided with slide holes II 20 matching with the guide rod 4 , and the circuit board 3 is slidably inserted into the corresponding guide rod 4 on the same side through the slide hole II 20 . By setting the guide rod 4, the guiding performance of the fixed plate 2 and the circuit board 3 when sliding up and down is improved, so that the movement thereof is smoother.

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PUM

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Abstract

The invention relates to a semiconductor laser whole aging device, which comprises: a die strip, a base, jacks, a fixed plate, a circuit board and a lamination mechanism. According to the invention, the whole die strip can be directly aged without dismounting the strip after the laser is welded, the production efficiency is greatly improved, and the die strip is cooperated with the base, so that direct contact between an operator and a laser is avoided, and the damage and pollution of the laser caused by manual factors are avoided. In the aging process, the die strip metal structure can be fully utilized for heat dissipation, and the self structure of the device can be effectively utilized for heat dissipation, so that the phenomena that the temperature of the laser is too high and fails due to untimely heat dissipation caused by aging of the laser are reduced, and the aging percent of pass is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser aging device and aging method. Background technique [0002] After decades of development, semiconductor lasers have become more and more well-known to the society and have been applied in many fields. The photoelectric conversion efficiency of semiconductor lasers is above 60%, which is much higher than that of other similar products. The advantages of low energy consumption, less heat accumulation in the device, long life, good collimation, and long lighting distance are more and more widely used as an emerging technology in similar industries in society. The various advantages of semiconductor lasers determine that they are getting more and more attention from all walks of life. It has been widely used in the fields of communication, medical treatment, display, industrial production and security, and its application range is gradually expand...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01M11/00
CPCG01M11/00G01R31/2601G01R31/2642
Inventor 张广明汤庆敏赵克宁贾旭涛
Owner 潍坊华光光电子有限公司
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