Circuit board with shielding structure and manufacturing method thereof

Abstract

A method for manufacturing a circuit board with a shielding structure, comprising the following steps: providing a first circuit board and a first substrate, and pressing the two first substrates onto the first circuit board through a first adhesive layer, the first The substrate includes a second base layer, a shielding layer, and a first copper layer; opening, electroplating, and etching processes are performed to form a third conductive circuit layer and a fourth conductive circuit layer, and the exposed shielding layer is removed; the second copper layer is provided, and Press the second copper layer through the second adhesive layer to form a semi-finished circuit board with shielding structure. The second copper layer and the second adhesive layer are pre-opened to form an opening on the semi-finished circuit board with shielding structure. In the window area, the shielding structure includes a shielding layer located in the windowed area; opening, electroplating, and etching processes are performed so that the second copper layer forms the fifth conductive circuit layer and the sixth conductive circuit layer, and the outer shielding layer on the windowed area removing the third conductive circuit layer and the fourth conductive circuit layer; and printing solder resist to form a protective layer.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board with a shielding structure and a manufacturing method thereof. Background technique [0002] In recent years, electronic products have been widely used in daily work and life. Compared with the design of general rigid circuit board + flexible board, the flexible and rigid board has the advantages of thinness, lightness, easy assembly, electrical signal transmission, and better product reliability. As consumer electronics products have increasingly stringent requirements for quality, thinness, and compactness, the proportion of circuit boards that are converted to rigid-flex designs is also increasing. When traditional soft-rigid boards or multi-layer FPC products that need to be opened need to be shielded in the open area, there are usually two ways to paste conductive cloth shielding film (EMI) with silver paste: one is shielding film covering...

AI Technical Summary

Problems solved by technology

When traditional soft-rigid boards or multi-layer FPC products that need to be opened need to be shielded in the open area, there are usually two ways to paste conductive cloth shielding film (EMI) with silver paste: one is shielding film covering Soft and hard junction area, but when the gap in the opening area is large, there will be a risk of air bubble damage during the lamination of the shielding film, which will cause the shielding in this area to fail and the impedance will be discontinuous; the other is that the shielding film only covers the window area , and this treatment method will shrink inward at the junction of the bonding position of the shielding film and the soft-hard combination, the junction cannot be shielded, and the impedance is discontinuous

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