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Chip assembly and preparation method thereof

A chip and component technology, applied in the field of chip components and preparation, can solve problems such as poor chip heat dissipation, and achieve good information transmission performance and good heat dissipation effect

Active Publication Date: 2020-05-12
SUZHOU TF AMD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The heat dissipation layer, chip, substrate, solder ball layer, and printed circuit board (PCB) are stacked in sequence. The solder ball layer can conduct signals so that signals can be transmitted smoothly between the substrate and the printed circuit board (PCB). However, the heat dissipation layer and the chip The colloid connection between them makes the heat dissipation of the chip not good

Method used

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  • Chip assembly and preparation method thereof
  • Chip assembly and preparation method thereof

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Embodiment Construction

[0041] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0042] first:

[0043] refer to Figure 1 to Figure 4 , a chip assembly includes a chip 3 and a substrate 4 . A surface of the substrate 4 is divided into a first area 41 and a second area 42, the second area 42 surrounds the first area 41, the chip 3 is arranged in the first area 41,

[0044] The chip assembly also includes a heat dissipation cover 11 and an elastic ad...

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PUM

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Abstract

The invention discloses a chip assembly and a preparation method thereof. The chip assembly comprises a chip, a substrate, a heat dissipation cover and an elastic adsorption assembly. One surface of the substrate is divided into a first region and a second region; the second region surrounds the first region; the chip is arranged in the first region; the heat dissipation cover is provided with anopening, the adsorption assembly is arranged on the edge of the opening of the heat dissipation cover, the heat dissipation cover covers the chip, the adsorption assembly is located between the secondregion of the substrate and the opening end of the heat dissipation cover, the heat dissipation cover is provided with at least one notch, and the notch corresponds to the second region. The chip assembly provided by the invention has a good heat dissipation effect and good information transmission performance.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip component and a preparation method. Background technique [0002] Packaged chips using ball grid array packaging technology (BGA), including heat dissipation layer, chip, substrate, solder ball layer and printed circuit board (PCB). [0003] The heat dissipation layer, chip, substrate, solder ball layer, and printed circuit board (PCB) are stacked in sequence. The solder ball layer can conduct signals so that signals can be transmitted smoothly between the substrate and the printed circuit board (PCB). However, the heat dissipation layer and the chip The space is connected by colloid, which makes the heat dissipation of the chip not good. Contents of the invention [0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a chip component and a manufacturing method to solve the problems raised in the above-mentioned...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/10H01L21/52
CPCH01L23/3675H01L23/10H01L21/52
Inventor 马晓波王金惠卢玉溪纪振帅
Owner SUZHOU TF AMD SEMICON CO LTD