A rapid preparation method of ink, a preparation method of thin film and a preparation method of oxide thin film transistor
A technology for oxide thin films and transistors, applied in the manufacturing of inks, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of time-consuming and long-term water bath treatment
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[0029] The present invention provides a rapid preparation method of ink, including the steps of:
[0030] Mix the metal salt raw material, an organic solvent, and a stabilizer to obtain a raw material mixture; the organic solvent is an alcohol ether solvent or an alcohol solvent;
[0031] The ultrasonic varicker is immersed in the raw material mixture, and the ultrasonic treatment is from 5 to 20 minutes to give ink.
[0032] The present invention first mixes a metal salt material, an organic solvent, and a stabilizer to obtain a raw material mixture; the organic solvent is an alcohol ether solvent or an alcohol solvent.
[0033] In the present invention, the metal salt feedstock is preferably a metal salt required to prepare an active layer or an insulating layer of a thin film transistor, more preferably a metal salt required to prepare an active layer or an insulating layer of an oxide thin film transistor; The metal salt is preferably a soluble metal salt; the ink is preferabl...
Embodiment 1
[0063] Next, the preparation of the oxide thin film transistor active layer precursor solution (ink) and an active layer (film) provided by the oxide thin film transistor provided by the present invention is further illustrated by the preparation of the oxide-thiramond tin oxide, and the present invention:
[0064] Penthal tetrachloride, zinc tin, dihydrate, and pentachloride was added to ethylene glycol methyl ether by molar ratio of 0.301: 0.689: 0.01 to obtain a metal salt solution having a total metal ion concentration of 0.3 mol / L. Ethanolamine is added to the metal salt solution to obtain a raw material mixture, wherein the total amount of metal ions and the moles of ethanolamine are 1: 2;
[0065] The ultrasonic gallophotol is immersed in the raw material mixture, the raw material mixture does not have the vibrating end of the ultrasonic hike, the bottom end of the vibrating end of the ultrasonic gallion and the bottom of the raw material mixed solution are 10 mm, and the...
Embodiment 2
[0071] The material of the deposition of the deposition source and drain, the source and the drain of the source, and the drain of the drain obtained in Example 1 were aluminum to obtain an oxide thin film transistor.
[0072] Test the transfer characteristic curve of the oxide thin film transistor obtained by the present embodiment, as a result, figure 2 Indicated.
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