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Smart card packaging method and packaging device

A packaging method and a technology of a packaging device, which are applied to record carriers used in machines, semiconductor/solid-state device parts, instruments, etc., can solve the problems of high production cost of smart cards, easy oxidation, and burnout of heating tubes, etc. Influenced by factors, high pass rate, and the effect of saving production costs

Active Publication Date: 2021-08-31
SHENZHEN YUANMINGJIE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This heavy-soldering packaging method often has the following problems: because the soldering head needs to contact the solder paste, it needs to be cleaned frequently to keep it clean, and the soldering head is prone to oxidation due to long-term contact with the solder paste, and needs to be replaced frequently, which is expensive
At the same time, the heating tube is used for heating. The high temperature generated during heating is easy to burn out the heating tube, which needs to be replaced regularly, resulting in higher production costs of the smart card.

Method used

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  • Smart card packaging method and packaging device
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  • Smart card packaging method and packaging device

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, in t...

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PUM

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Abstract

The invention discloses a smart card packaging method and packaging device. Wherein, the packaging method includes the following steps: using a laser to melt the solder paste dotted on the surface of the card; using hot pressing to press and connect the chip coated with hot melt adhesive to the card after melting, so that The chip and the card are connected as a whole through hot melt adhesive and solder paste; hot pressing is performed on the surface of the chip facing away from the card to obtain a flat packaging device for the smart card. The technical scheme of the invention can reduce the production cost of the smart card.

Description

technical field [0001] The invention relates to the technical field of smart card packaging, in particular to a smart card packaging method and packaging device. Background technique [0002] At present, in the packaging process of the smart card, the solder paste is usually soldered and packaged by means of heat transfer from a heat pipe to heat a thermal soldering head when soldering the package. This heavy-soldering packaging method often has the following problems: because the soldering head needs to contact the solder paste, it needs to be cleaned frequently to keep it clean, and the soldering head is prone to oxidation due to long-term contact with the solder paste, and needs to be replaced frequently, which is expensive . At the same time, the heating tube is used for heating. The high temperature generated during heating will easily burn out the heating tube, which needs to be replaced regularly, resulting in higher production cost of the smart card. [0003] The a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/498G06K19/077
CPCG06K19/07745H01L21/4839H01L23/49855
Inventor 鲍伟海万飞云黄锡龙黎理明
Owner SHENZHEN YUANMINGJIE TECH