Polishing device for copper balls

A polishing device and copper ball technology are applied in grinding/polishing equipment, machine tools suitable for grinding the edge of workpieces, machine tools for surface polishing, etc., which can solve the problems of low work efficiency and inconvenient grinding, and achieve increased efficiency and speed effect

Inactive Publication Date: 2020-05-22
WUWEI HUANJIANG COPPER IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Some existing devices use sandpaper or other grinding tools to polish and polish the copper ball after clamping it. The overall work efficiency is low, and the position where the copper ball is clamped is inconvenient to be polished and needs to be readjusted. sanding later

Method used

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  • Polishing device for copper balls
  • Polishing device for copper balls
  • Polishing device for copper balls

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Embodiment Construction

[0022] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be described more clearly and completely below in conjunction with the accompanying drawings in the embodiments. Of course, the described embodiments are only a part of the present invention. Not all, based on this embodiment, other embodiments obtained by those skilled in the art without creative efforts are all within the protection scope of the present invention.

[0023] Such as Figure 1 to Figure 3 As shown, a grinding and polishing device for copper balls includes a box assembly 1, and a grinding assembly 2 is arranged inside the box assembly 1. The grinding assembly 2 includes a concave conveyor belt 21, which is driven by the conveyor belt 21 The copper balls and the grinding balls rotate and roll together to rub against each other for grinding.

[0024] The box assembly 1 includes a processing bin 11 , a discharge hoppe...

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Abstract

The invention relates to a polishing device for copper balls. The polishing device for copper balls comprises a box body assembly, wherein a polishing assembly is arranged in the box body assembly, the polishing assembly comprises a conveying belt which is in a downward concave shape, and the conveying belt drives the thrown copper balls and polishing pills to rotate, roll and rub each other for polishing. Side baffle plates are arranged on the two sides of the downward concave conveying belt, first gaps are formed between the side baffle plates and the conveying belt and used for dischargingscraps and sundries polished from the copper balls, a turnover plate is used for bringing the polished copper balls and the polishing pills on the conveying belt upwards, but a second gap between theturnover plate and the conveying belt is used for leaking the polishing pills, so that the polishing pills repeatedly polish the copper balls on the conveying belt. The polishing pills and the copperballs are mixed together by the downward concave conveying belt to be fully overturned and mutually rubbed and polished, so that the copper balls are polished clean, a large number of copper balls canbe processed and polished at one time, and the polishing efficiency and the polishing speed are increased.

Description

technical field [0001] The invention relates to the technical field of copper ball processing, in particular to a grinding and polishing device for copper balls. Background technique [0002] Grinding is a kind of surface modification technology. It generally refers to a processing method that uses rough objects (sandpaper containing higher hardness particles, etc.) to change the physical properties of the material surface through friction. The main purpose is to obtain a specific surface roughness. [0003] Some existing devices use sandpaper or other grinding tools to grind and polish the copper ball after clamping it. The overall work efficiency is low, and the position where the copper ball is clamped is inconvenient to be polished and needs to be readjusted. Then sand it. Contents of the invention [0004] Now in order to meet the above-mentioned requirements for fast grinding and polishing of a large number of copper balls, the present invention proposes a grinding ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B31/10B24B31/12B24B41/02B24B41/00
CPCB24B31/10B24B31/12B24B41/005B24B41/02
Inventor 游奕明
Owner WUWEI HUANJIANG COPPER IND
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