Rapid cap cutting device and method for semiconductor laser tube cap

Abstract

A rapid cap cutting device for a semiconductor laser tube cap comprises a base, N fixing seats, a fixing seat driving mechanism, a laser fixing plate and a cutting knife. The laser fixing plate can beinstalled in place after being inserted on a guide rod through a guide hole I, tube legs of lasers are inserted into corresponding insertion holes in the fixing seats, the fixing seat driving mechanism drives each fixing seat to rotate, rotation of each laser is achieved, the cutting knife is pressed downwards, a cutting edge below the cutting knife is in contact with the corresponding tube cap,and the rotating tube cap is cut off by the cutting edge. The tube legs are inserted into the insertion holes, so that the tube legs can be effectively protected, and the tube legs cannot be bent andfolded. When the tube cap is cut, the cutting force on the tube cap is uniform, the end face of the cut tube cap is tidy, deformation of the tube cap during cutting can not occur, damage to the insides of the lasers can not occur, and the product quality of cap cutting is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a fast cap cutting device and a cap cutting method for a semiconductor laser tube cap. Background technique [0002] After decades of development, semiconductor lasers have become more and more well-known to the society and have been applied in many fields. The photoelectric conversion efficiency of semiconductor lasers is above 60%, which is much higher than that of other similar products. The advantages of low energy consumption, less heat accumulation in the device, long life, good collimation, and long lighting distance are more and more widely used as an emerging technology in similar industries in society. The various advantages of semiconductor lasers determine that they are getting more and more attention from all walks of life. [0003] Due to the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, semiconducto...

AI Technical Summary

Problems solved by technology

Using this method to cut the cap is inefficient, only one cap can be cut at a time, and the cap is made of aluminum, it is laborious to cut, and it is difficult to control the force during the cutting process, which is very easy to cause deformation of the cap, thus touching The chip or gold wire structure inside the laser causes the laser to fail. During the clamping process, the three tube legs are subjected to external forces, which may easily cause the tube legs to close together due to deformation, affecting the use effect

Images