Resin composition for printed wiring board, copper foil with resin, copper clad laminate, and printed wiring board

A technology of resin composition and printed circuit board, which is applied to printed circuit components, circuit substrate materials, etc., and can solve problems such as poor dielectric properties, high dielectric loss tangent, and unsuitability for high frequencies

Active Publication Date: 2021-12-03
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the copper foil with a resin layer disclosed in Reference 1 can achieve improved adhesion to resin substrates such as prepregs, it has a high dielectric loss tangent and poor dielectric properties, so it is not suitable for High frequency use

Method used

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  • Resin composition for printed wiring board, copper foil with resin, copper clad laminate, and printed wiring board
  • Resin composition for printed wiring board, copper foil with resin, copper clad laminate, and printed wiring board
  • Resin composition for printed wiring board, copper foil with resin, copper clad laminate, and printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0053] The present invention is further specifically described based on the following examples.

example 1～18

[0055] A resin varnish containing a resin composition was prepared, and a resin-attached copper foil was produced and evaluated using the resin varnish. Specifically, as follows.

[0056] (1) Preparation of resin varnish

[0057] First, as raw material components for resin varnishes, the following resin components, imidazole-based hardening accelerators, and inorganic fillers were prepared.

[0058] -Epoxy resin: Nippon Kayaku Co., Ltd., NC-3000H (biphenylaralkyl type, epoxy equivalent 288g / Eq)

[0059] -Maleimide resin: manufactured by Nippon Kayaku Co., Ltd., MIR-3000 (biphenyl aralkyl type, functional group equivalent 275 g / Eq)

[0060] -Polyimide resin: manufactured by Arakawa Chemical Industry Co., Ltd., PIAD-301 (terminal functional group: carboxyl group; solvent: mixed solution of cyclohexanone, methylcyclohexane, and ethylene glycol dimethyl ether; dielectric constant ( 1GHz): 2.70; dielectric loss tangent (1GHz): 0.003; softening point: 140°C)

[0061] -Phenolic r...

example 19

[0119] Example 19 (Compare)

[0120] Use 260 parts by weight of phenolic resin (Meiwa Chemicals Co., Ltd., MEH-7500) instead of maleimide resin, polyimide resin, polycarbodiimide resin and thermoplastic elastomer, and make the epoxy resin 100 parts by weight. The preparation and various evaluations of the resin varnish were performed in the same manner as in Example 9 except for the parts by weight. The results are shown in Table 3.

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Abstract

The present invention provides: excellent dielectric properties (extremely low dielectric loss tangent) suitable for high-frequency applications can be exhibited, and excellent interlayer adhesion can be exerted when forming a copper-clad laminate or a printed circuit board Resin composition for printed circuit boards with excellent performance and heat resistance. The composition comprises: a maleimide resin; a polyimide resin in an amount of 150 parts by weight or more and 1200 parts by weight or less with respect to 100 parts by weight of the maleimide resin; 100 parts by weight of the amine resin is polycarbodiimide resin in an amount of not less than 15 parts by weight and not more than 120 parts by weight.

Description

technical field [0001] The present invention relates to a resin composition for printed wiring boards, a resin-coated copper foil, a copper-clad laminate, and a printed wiring board. Background technique [0002] As the copper foil used in the production of copper-clad laminates and printed wiring boards, there is known a resin-coated copper foil provided with a resin layer on one surface for improving the adhesiveness with resin substrates such as prepregs. The term "prepreg" is a general term for a composite material in which a synthetic resin is impregnated into a substrate such as a synthetic resin plate, glass plate, glass fabric, glass nonwoven fabric, or paper. For example, Patent Document 1 (Japanese Patent No. 5118469) discloses a copper foil with a resin layer, which has a filler particle-containing resin layer on the surface of the copper foil, and describes that the filler particle-containing resin layer contains aromatic polyamide Resin polymer, epoxy resin and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L35/00C08K3/36C08L79/02C08L79/08H05K1/03
CPCC08K3/36C08L35/00C08L79/02C08L79/08H05K1/03
Inventor 细井俊宏米田祥浩松岛敏文
Owner MITSUI MINING & SMELTING CO LTD
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