34results about How to "Excellent adhesion between layers" patented technology

Provided is a zinc-plated steel sheet for hot pressing having outstanding surface characteristics, comprising: a steel foundation plate comprising a metal surface diffusion layer of which the Gibbs free energy reduction per mole of oxygen during oxidation is less than that of Cr; an aluminum-rich layer containing at least 30 wt. % of aluminium formed on the surface diffusion layer, and a zinc plating layer formed on the aluminum-rich layer. In this way, a metal having a low affinity for oxygen is coated to an effective thickness prior to annealing and thus the creation of annealing oxides at the surface of the steel sheet is suppressed and a uniform zinc plating layer is formed, and alloying of the zinc plating layer is promoted during press-processing heat treatment. Cracking in the steel foundation plate during hot press molding is prevented.

Disclosed is an aqueous dispersion composition which enables to form a primer layer that is excellent in interlayer adhesion with a top coat layer containing a fluororesin and capable of improving hardness and wear resistance of a coating film as a whole. Also disclosed is a coating film structure using such an aqueous dispersion composition. Specifically disclosed is an aqueous dispersion composition for primers for fluororesin coating film layers, which contains (A) a water-soluble, curable polyamideimide and/or polyimide binder polymer, (B) ceramic spherical particles, (C) modified PTFE particles and (D) an aqueous medium. This aqueous dispersion composition for primers is characterized in that the modified PTFE particles (C) have a melt creep viscosity at 380 DEG C within the range from 2*10<9> to 1*10<11> Pas, and a standard relative density of not more than 2.170. A primer layer is formed by using such an aqueous dispersion composition for primers, and a top coat layer containing a fluororesin is formed thereon.

Is disclosed a process for producing a metal wiring substrate comprising a heat resistant resin substrate and a metal wiring which is laminated on the substrate and in which a surface laminated with the substrate is surface-treated with at least one metal selected from Ni, Cr, Co, Zn, Sn and Mo or an alloy comprising at least one of these metals (hereafter, the metal used for the surface-treatment is referred to as a surface-treatment metal). This process comprises the steps of forming the metal wiring on the resin substrate, and washing at least a surface of the resin substrate with an etching solution capable of removing the surface-treatment metal to increase adhesion of the surface of the resin substrate. The produced metal wiring substrate has excellent adhesion with adhesives for affixing anisotropic conductive films and IC chips to films.

The invention relates to a base coating composition for non-ferrous metal, which can exhibit excellent initial stage adhesion, interlayer adhesion, recoating performance and scratch resistance in the coating of non-ferrous metal by containing polyester polyhydric alcohol resin, acrylic acid polyhydric alcohol resin, melamine resin, epoxy resin and the balance of a solvent, and a coating object.

The present invention provides a multilayer film which reflects light within a specific band, and which is free from the problem of delamination that occurs in cases where a polyethylene naphthalate resin is used therefor. A multilayer film which has 201 or more layers obtained by alternately laminating layers A that are formed of a polyester A containing ethylene-2,6-naphthalate as a main repeating unit and layers B that are formed of a polyester B containing ethylene terephthalate as a main repeating unit and having a refractive index lower than that of the polyester constituting the layers A. This multilayer film is characterized in that the polyester A satisfies the following requirements. (1) The amount of terminal carboxylic acid groups is from 5 eq/t to 20 eq/t (inclusive). (2) An alkali metal phosphate salt is contained in an amount of from 1.3 mol/ton to 3.0 mol/ton (inclusive), and phosphoric acid is contained at a molar ratio of from 0.4 times to 1.5 times (inclusive) relative to the alkali metal phosphate salt. (3) The intrinsic viscosity is from 0.55 to 0.63 (inclusive).

A laminated sheet having: a layer having a polybutylene terephthalate resin as a principal component (P1 layer); and a layer having a polyolefin resin as a principal component (P3 layer). A solar cell back sheet, characterized in that the acetic acid permeability (Pa) (g/m2/day) at 85°C and water vapor permeability (Pw) (g/m2/day) at 40°C 90% RH satisfy relationships (1) 200 ≤ Pa and (2) Pw ≤ 2.5. Provided are a laminated sheet having a better moist heat resistance and an improved capacity to obtain both heat resistance and adhesion performance with respect to a sealing member compared with a conventional laminated sheet in which a polybutylene terephthalate resin is used, and a method for manufacturing the laminated sheet. Also provided are a solar cell module back sheet that is inexpensive and that is capable of preventing discoloration of the collector electrode of a solar cell while maintaining the power generation characteristics of the solar cell module over a long period, and a method for manufacturing the solar cell module back sheet.

The invention discloses a paint, which is made of the following materials in parts by weight: 100-200 parts of acrylic modified resin latex, 10-15 parts of low-molecular-weight polyethylene, 10-20 parts of high-molecular-weight polyethylene, nanoelectric 10-30 parts of stone powder, 10-20 parts of nanometer far-infrared ceramic powder, 100-200 parts of pigment, 30-40 parts of dipropylene glycol methyl ether acetate, 10-20 parts of additives; among them, the solid content of acrylic modified resin latex It is 80-90%, adding a small amount of low-molecular-weight polyethylene and high-molecular-weight polyethylene to the coating of the present invention can combine with each other to improve the cold resistance of the coating, without cracking, impact resistance, and can reduce the heat absorption of the coating.

Provided is a resin composition for a printed wiring board capable of exhibiting excellent dielectric properties (extremely low dissipation factor tangent) appropriate for high-frequency use, and, when used in a copper-clad laminate board or a printed wiring board, can demonstrate excellent adherence between layers, and heat resistance. This composition includes: a maleimide resin; a polyimide resin in the amount of 150-1200 parts by weight per 100 parts by weight of the maleimide resin; and a polycarbodiimide resin in the amount of 15-120 parts by weight per 100 parts by weight of the maleimide resin.

The present invention relates to a production method for an in-mould, semi-cured transfer film. More specifically, it relates to a production method for an in-mould, semi-cured transfer film which has a laminated structure comprising, in sequence on a base film: a mould-release layer and a protective layer, a print layer, a vapour-deposited layer and an adhesive layer. The said transfer film doesnot produce harmful substances such as formaldehyde (HCHO) during the production process, and can endow injection moulded articles with highly outstanding physical properties when it is used.

The invention relates to a method and device for manufacturing a carbon fiber reinforced resin matrix composite material current heating LOM, wherein a prepreg tape of the carbon fiber reinforced resin-based composite material is conveyed to the upper part of a working platform, the working platform is moved upward to fit the prepreg tape, a pressing plate mechanism moves downwards to press the prepreg tape on the working platform, at the same time, the electrodes at both ends of the pressing plate are powered on the prepreg tape of a pressing area, the pressing plate mechanism is moved upwardaway from the prepreg tape after the prepreg tape is heated and solidified, a laser emitter cuts the prepreg tape along the cross-section of the three-dimensional model, the outer part of the cross-section is cut into fine pieces, and after the cutting is finished, the working platform descends off the prepreg tape, and then the whole prepreg tape is conveyed to the upper part of the working platform, the residual prepreg tape is retracted by a winding drum after being cut, that is, the single-layer forming and solidifying is completed, a process is recycled until the forming and solidifyingof the whole three-dimensional solid component is completed, that is, the required three-dimensional solid component is obtained; the forming mode is rapid and unsupported; the solidifying technologyis low in consumption and energy-saving.