Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board

A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit components, circuit substrate materials, etc., and can solve the problems of high dielectric loss tangent, unsuitable high frequency, poor dielectric properties, etc.

Active Publication Date: 2020-05-26
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the copper foil with a resin layer disclosed in Reference 1 can achieve improved adhesion to resin substrates su

Method used

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  • Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board
  • Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board
  • Resin composition for printed wiring board, copper foil with resin, copper-clad laminate board, and printed wiring board

Examples

Experimental program
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Effect test

Embodiment

[0053] The present invention will be further explained in detail based on the following examples.

example 1～18

[0055] A resin varnish containing the resin composition was prepared, and the resin varnish was used to manufacture and evaluate a copper foil with resin. Specifically, it is as follows.

[0056] (1) Preparation of resin varnish

[0057] First, as raw material components for a resin varnish, the resin components shown below, an imidazole-based curing accelerator, and an inorganic filler are prepared.

[0058] -Epoxy resin: manufactured by Nippon Kayaku Co., Ltd., NC-3000H (biphenyl aralkyl type, epoxy equivalent 288g / Eq)

[0059] -Maleimide resin: Nippon Kayaku Co., Ltd., MIR-3000 (biphenyl aralkyl type, functional group equivalent 275g / Eq)

[0060] -Polyimide resin: manufactured by Arakawa Chemical Industry Co., Ltd., PIAD-301 (terminal functional group: carboxyl group; solvent: mixture of cyclohexanone, methylcyclohexane and ethylene glycol dimethyl ether; dielectric constant ( 1GHz): 2.70; Dielectric loss tangent (1GHz): 0.003; Softening point: 140℃)

[0061] -Phenolic resin (manufa...

example 19

[0119] Example 19 (Comparison)

[0120] 260 parts by weight of phenolic resin (manufactured by Meiwa Chemical Co., Ltd., MEH-7500) was used instead of maleimide resin, polyimide resin, polycarbodiimide resin, and thermoplastic elastomer, and the epoxy resin was 100 Except for the parts by weight, the preparation of the resin varnish and various evaluations were performed in the same manner as in Example 9. The results are shown in Table 3.

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Abstract

Provided is a resin composition for a printed wiring board capable of exhibiting excellent dielectric properties (extremely low dissipation factor tangent) appropriate for high-frequency use, and, when used in a copper-clad laminate board or a printed wiring board, can demonstrate excellent adherence between layers, and heat resistance. This composition includes: a maleimide resin; a polyimide resin in the amount of 150-1200 parts by weight per 100 parts by weight of the maleimide resin; and a polycarbodiimide resin in the amount of 15-120 parts by weight per 100 parts by weight of the maleimide resin.

Description

Technical field [0001] The present invention relates to a resin composition for a printed circuit board, a copper foil with resin, a copper clad laminate, and a printed circuit board. Background technique [0002] As a copper foil used in the manufacture of a copper-clad laminate and a printed circuit board, a resin-coated copper foil having a resin layer on one side is known to improve adhesion to a resin substrate such as a prepreg. It should be noted that prepreg refers to a general term for composite materials in which synthetic resin is impregnated into a base material such as a synthetic resin plate, glass plate, glass woven fabric, glass non-woven fabric, and paper. For example, Patent Literature 1 (Japanese Patent No. 5118469) discloses a copper foil with a resin layer, which has a filler particle-containing resin layer on the surface of the copper foil, and describes that the filler particle-containing resin layer contains an aromatic polyamide Resin polymer, epoxy resi...

Claims

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Application Information

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IPC IPC(8): C08L35/00C08K3/36C08L79/02C08L79/08H05K1/03
CPCC08K3/36C08L35/00C08L79/02C08L79/08H05K1/03
Inventor 细井俊宏米田祥浩松岛敏文
Owner MITSUI MINING & SMELTING CO LTD
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