Formed body, production method thereof, electronic device member and electronic device

一种制造方法、成形体的技术，应用在半导体/固态器件制造、电气元件、化学仪器和方法等方向，能够解决阻气性片材的膜变厚、工序数多、无法表现出阻气性能等问题，达到层间密合性和阻气性优异的效果

Active Publication Date: 2015-04-29
LINTEC CORP
View PDF30 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the gas barrier sheets described in these documents have the following problems: the interlayer adhesion between the smooth layer and the inorganic material layer used as the gas barrier layer and electrode material is poor, and it is necessary to provide a layer between each layer to improve the interlayer. Adhesive functional film, the thickness of the obtained gas barrier sheet becomes thicker, and the number of steps increases accordingly
However, this method has a problem that sufficient gas barrier performance cannot be exhibited without controlling the thickness of the gas barrier layer to the order of microns

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Formed body, production method thereof, electronic device member and electronic device
  • Formed body, production method thereof, electronic device member and electronic device
  • Formed body, production method thereof, electronic device member and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0341] A composition containing an acryloyl group-containing silicon-containing compound as a main component (trade name: AC-SQ TA-100, manufactured by Toagosei Co., Ltd.) was dissolved in ethyl acetate, and then 2 , 4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: DarocurTPO, manufactured by Ciba Specialty Chemicals Co., Ltd.), so that 2,4,6-trimethylbenzoyl-diphenyl The base phosphine oxide was 3 mass % by solid content ratio, and the solution A for primer layer formation was prepared.

[0342] The aforementioned primer was applied to a polyethylene terephthalate film (trade name: PET25T-61M, thickness 25 μm, manufactured by Toray Industries Inc., hereinafter referred to as "PET film") as a substrate layer. Solution A for layer formation was heated at 120° C. for 1 minute, and then irradiated with UV light using UV light rays (high-pressure mercury lamp, line speed, 20 m / min, cumulative light intensity 100 mJ / cm 2 , peak intensity 1.466W, number of passes 2 times),...

Embodiment 2

[0355] 1.90 g of tetraethoxysilane (trade name: Z-6697, manufactured by Dow Corning Toray Co., Ltd.) (12.5 mmol) and 8.79 g of 3-methacryloxypropyltriethoxysilane (commercial Name: KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.) (37.5 mmol) was dissolved in 50 ml of ethyl acetate, and 25 ml of distilled water was added and mixed. Several drops of phosphoric acid as a catalyst were added to the resulting mixture, followed by stirring at room temperature for 18 hours. After neutralizing by adding saturated aqueous sodium bicarbonate solution to the reaction liquid, liquid separation was performed to separate the organic layer. The organic layer was dried with anhydrous magnesium sulfate, ethyl acetate was distilled off under reduced pressure, and the residue was added to a large amount of n-hexane to obtain a precipitate. Next, the obtained precipitate was dissolved in ethyl acetate, and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (trade name: DarocurTPO, Ciba Special...

Embodiment 3

[0358] In Example 2, the usage amount of tetraethoxysilane was changed from 1.90g (12.5mmol) to 3.81g (25.0mmol), and the usage amount of 3-methacryloxypropyltriethoxysilane was changed from Except having changed 8.79g (37.5mmol) into 5.86g (25.0mmol), it carried out similarly to Example 2, and prepared the solution C for primer layer formation.

[0359] In Example 1, except having used the solution C for primer layer formation instead of the solution A for primer layer formation, it carried out similarly to Example 1, and the molded object 3 was produced.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
densityaaaaaaaaaa
diameteraaaaaaaaaa
Login to view more

Abstract

The present invention is a formed article sequentially including a base layer, a primer layer, and a gas barrier layer, the primer layer being formed of a material that includes at least a carbon atom, an oxygen atom, and a silicon atom, and is characterized in that a peak position of binding energy of 2p electrons of the silicon atom as determined by X-ray photoelectron spectroscopy (XPS) is 101.5 to 104 eV, and the gas barrier layer (I) being a layer obtained by implanting ions into a polymer layer that includes at least one compound selected from a group consisting of a polysilazane compound, a polyorganosiloxane compound, a polycarbosilane compound, and a polysilane compound, or (II) being formed of a material that includes at least an oxygen atom and a silicon atom, a surface layer part of the gas barrier layer having an oxygen atom content rate of 60 to 75%, a nitrogen atom content rate of 0 to 10%, and a silicon atom content rate of 25 to 35%, based on a total content rate of oxygen atoms, nitrogen atoms, and silicon atoms, and the surface layer part of the gas barrier layer having a film density of 2.4 to 4.0 g / cm 3 . Also provided are a method for forming the same, an electronic device member including the formed article, and an electronic device including the electronic device member.

Description

technical field [0001] The present invention relates to a molded body, a method for producing the molded body, a member for an electronic device including the molded body, and an electronic device including the member for an electronic device. Background technique [0002] In recent years, for image display devices, attempts have been made to manufacture flexible displays using synthetic resin sheets instead of glass substrates. However, compared with glass, synthetic resin sheets have problems such as easy permeation of gases such as water vapor and low surface smoothness, and there are many problems in practical use. [0003] In order to solve such problems, Patent Documents 1 and 2 propose a gas barrier sheet in which a smooth layer is provided on a synthetic resin sheet, and a gas barrier inorganic compound film is further laminated. [0004] However, the gas barrier sheets described in these documents have the following problems: the interlayer adhesion between the smo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/00G02F1/1333H01L21/265C23C14/48C08J7/043C08J7/044C08J7/048
CPCC23C14/06C23C14/48H01L21/2236C08J7/042C08J7/123C08J2367/02C08J2483/04Y10T428/31663C08J7/048C08J7/043C08J7/044B32B27/06G02F1/1333H01L21/265C09D183/06C09D183/08
Inventor 铃木悠太近藤健
Owner LINTEC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap