The purpose of the present invention is to provide a novel
alloy-coated Cu bonding wire which has a good FAB shape, has good initial bonding properties of a second bonding part, which is represented by adhesion of the second bonding part, and has good bonding reliability of the second bonding part by suppressing
electrochemical corrosion in a high-temperature environment. The
alloy-coated Cu bonding wire is characterized by comprising a core material comprising Cu or a Cu
alloy, and a
coating layer formed on the surface of the core material and having a total concentration of Pd and Ni of 90 at% or more, the thickness of the
coating layer is 10 nm or more and 130 nm or less in a concentration distribution in the
depth direction of a line measured by
Auger electron spectroscopy (AES) such that the depth-direction measurement points are 50 or more in the
coating layer. When the average value of the ratio CPd / CNi of the Pd concentration CPd (atomic%) to the Ni concentration CNi (atomic%) for all measurement points of the coating layer is defined as X, the average value X is 0.1-35.0, the total number of measurement points in the coating layer having an
absolute deviation of 0.3 X or less from the average value X is 50% or more relative to the total number of measurement points of the coating layer, and the following condition (A) is satisfied, where X represents the average value of the ratio CPd / CNi of the Pd concentration CPd (atomic%) to the Ni concentration CNi (atomic%), and X represents the average value of the ratio CPd / CNi of the Pd concentration CPd (atomic%) to the Ni concentration CNi (atomic%). (A) contains one or more elements selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Zn, Zr, Nb, Mo, Ru, Rh, Sn, Ta, W, Os, Ir, Pt, Au, and Bi (hereinafter referred to as a "first additive element"). ) The total concentration of the first additive element with respect to the entire wire is from 5 ppm by
mass to 450 ppm by
mass (inclusive).