A thermocouple high-temperature testing system comprises a tungsten-rhenium thermocouple, an analogue processing circuit, an A/D converter, an SRAM (static random access memory) chip, a CPLD (complex programmable logic device) chip, a singlechip, a cool end compensation temperature sensor, a USB interface and a computer. The thermocouple high-temperature testing system provided by the invention is a miniaturized testing system which integrates a sensor, an adaptive magnifier, an A/D converter, a memorizer, a control circuit, an interface circuit and a minicell together. In the system, SRAM serves as a memorizer, after testing, data reading is achieved through the USB interface, and data information can be recorded, collected and measured objectively. The tungsten-rhenium thermocouple has the advantages of short responding time, wide measuring range, capability of testing a high-temperature section with the temperature higher than 2000 centigrade, simplicity and reliability in overall system operation, and accurate measurement, thereby being capable of ensuring the temperature measuring accuracy.