Thermocouple high-temperature testing system

Abstract

A thermocouple high-temperature testing system comprises a tungsten-rhenium thermocouple, an analogue processing circuit, an A/D converter, an SRAM (static random access memory) chip, a CPLD (complex programmable logic device) chip, a singlechip, a cool end compensation temperature sensor, a USB interface and a computer. The thermocouple high-temperature testing system provided by the invention is a miniaturized testing system which integrates a sensor, an adaptive magnifier, an A/D converter, a memorizer, a control circuit, an interface circuit and a minicell together. In the system, SRAM serves as a memorizer, after testing, data reading is achieved through the USB interface, and data information can be recorded, collected and measured objectively. The tungsten-rhenium thermocouple has the advantages of short responding time, wide measuring range, capability of testing a high-temperature section with the temperature higher than 2000 centigrade, simplicity and reliability in overall system operation, and accurate measurement, thereby being capable of ensuring the temperature measuring accuracy.

Description

technical field [0001] The invention belongs to the technical field of high temperature testing, in particular to a thermocouple high temperature testing system. Background technique [0002] In different temperature fields, especially in high-temperature environments, how to conduct real-time, fast and accurate temperature tests has always been a topic of concern to those skilled in the art. However, the problem with the commonly used high-temperature test systems is the response time. Long, small measurement range, poor operating reliability, and low measurement accuracy, resulting in poor temperature measurement accuracy. Contents of the invention [0003] In order to solve the above problems, the object of the present invention is to provide a thermocouple high temperature testing system. [0004] In order to achieve the above object, the thermocouple high-temperature test system provided by the present invention includes: tungsten-rhenium thermocouple, analog process...

AI Technical Summary

Problems solved by technology

[0002] In different temperature fields, especially in high-temperature environments, how to conduct real-time, fast and accurate temperature tests has always been a topic of concern to those skilled in the art. However, the problem with the commonly used high-temperature test systems is the response time. Long, small measurement range, poor operation reliability, low measurement accuracy, resulting in poor accuracy of temperature measurement

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