Revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition

Abstract

The invention discloses a revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition. The structure comprises a revolution bottom tray, a revolution top tray,pot evaporation deposition autorotation modules and multiple wafer carrying trays. The revolution top tray runs around the revolution bottom tray through supporting parts. The pot evaporation deposition autorotation modules are provided with cantilevers to be combined to the revolution top tray, gear trays of the pot evaporation deposition autorotation modules are combined to the bottom sides ofthe cantilevers, and autorotation evaporation deposition trays of the pot evaporation deposition autorotation modules are combined to the cantilevers and run around a round surrounding rail. The wafercarrying trays are fixedly arranged on the autorotation evaporation deposition trays through rotating shafts and are rotationally combined with the gear trays through outer annular teeth.

Description

technical field [0001] The present invention is a 3D vapor deposition male spin coating pot structure, in particular a 3D vapor deposition male spin coating pot structure using semiconductor wafer vapor deposition. Background technique [0002] China Taiwan Patent Announcement No. 00470215 (hereinafter referred to as Patent No. 215), discloses a fixed structure of a public and self-rotating wafer carrier, which mainly discloses a revolution frame and a rotatable wafer carrier P13, but there are The following questions: [0003] 1. There are only two rotation axes P110 and P120, and the wafer cannot rotate during evaporation, which will cause shadows due to directionality and cause inconsistent film thickness. [0004] 2. The wafer carrier P13 must be driven by the shaft AP131 to rotate, and the shaft AP131 plus the driving unit that must rotate accordingly will increase the volume of the equipment. [0005] 3. The entire wafer carrier P13 must be supported by the roller P1...

AI Technical Summary

Problems solved by technology

[0012] The present invention is a male-rotating coating pot structure for 3D evaporation, which mainly solves the problems caused by unstable support of the coating pot structure, inability to provide linear operation, and poor design of the evaporation angle when the coating pot performs evaporation on wafers. Poor coating thickness uniformity, poor step coverage, and inconsistent coating structure

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