Revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition

A technology of revolution and evaporation, applied in vacuum evaporation coating, sputtering coating, ion implantation coating, etc., can solve the problems of poor step coverage, inconsistent coating structure, unable to provide linear operation, etc., to achieve stable structural support , The effect of better coating thickness uniformity

Active Publication Date: 2020-05-29
HERMES EPITEK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The present invention is a male-rotating coating pot structure for 3D evaporation, which mainly solves the problems caused by unstable support of the coating pot structure, inability to provide

Method used

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  • Revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition
  • Revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition
  • Revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition

Examples

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Embodiment Construction

[0058] like Figure 2 to Figure 4 As shown, the present embodiment is a male-rotating coating pot structure 100 for 3D evaporation, which includes: a revolving bottom plate 10 ; a revolving top plate 20 ; a plurality of coating pot rotation modules 30 ; and a plurality of wafer carriers 40 .

[0059] The revolving base 10 is used as the bottom support of the entire revolving coating pot structure 100 , and in order to achieve the effect of rotation, the revolving base 10 can be a circular orbit.

[0060] The revolving top plate 20 has a plurality of supports 210 so that the revolving top plate 20 can be erected on the revolving chassis 10 . In order to make the revolving top plate 20 rotate effectively, a revolving wheel 220 can be provided at the bottom of each supporting member 210 . The revolving top plate 20 can smoothly run around the revolving chassis 10 by means of the revolving runner 220 .

[0061]In order to allow the revolving top plate 20 to be arranged on the re...

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Abstract

The invention discloses a revolution and autorotation pot evaporation deposition structure adopting 3D evaporation deposition. The structure comprises a revolution bottom tray, a revolution top tray,pot evaporation deposition autorotation modules and multiple wafer carrying trays. The revolution top tray runs around the revolution bottom tray through supporting parts. The pot evaporation deposition autorotation modules are provided with cantilevers to be combined to the revolution top tray, gear trays of the pot evaporation deposition autorotation modules are combined to the bottom sides ofthe cantilevers, and autorotation evaporation deposition trays of the pot evaporation deposition autorotation modules are combined to the cantilevers and run around a round surrounding rail. The wafercarrying trays are fixedly arranged on the autorotation evaporation deposition trays through rotating shafts and are rotationally combined with the gear trays through outer annular teeth.

Description

technical field [0001] The present invention is a 3D vapor deposition male spin coating pot structure, in particular a 3D vapor deposition male spin coating pot structure using semiconductor wafer vapor deposition. Background technique [0002] China Taiwan Patent Announcement No. 00470215 (hereinafter referred to as Patent No. 215), discloses a fixed structure of a public and self-rotating wafer carrier, which mainly discloses a revolution frame and a rotatable wafer carrier P13, but there are The following questions: [0003] 1. There are only two rotation axes P110 and P120, and the wafer cannot rotate during evaporation, which will cause shadows due to directionality and cause inconsistent film thickness. [0004] 2. The wafer carrier P13 must be driven by the shaft AP131 to rotate, and the shaft AP131 plus the driving unit that must rotate accordingly will increase the volume of the equipment. [0005] 3. The entire wafer carrier P13 must be supported by the roller P1...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/50
CPCC23C14/24C23C14/505
Inventor 陈家璧薛文皓罗世欣
Owner HERMES EPITEK
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