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Heater assembly

A heater and component technology, applied in ohmic resistance heating, semiconductor/solid-state device manufacturing, electric heating devices, etc., can solve the problems of complex and difficult structure, and achieve heating and cooling, interruption prevention, precision heating and cooling. Effect

Inactive Publication Date: 2020-05-29
H&IRUJA有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the conventional heater assembly usually uses a linear heater, so the structure for heating and cooling of the heater assembly is complicated, and it is difficult to quickly heat the heater and then rapidly cool it again. improved and precise control

Method used

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Embodiment Construction

[0044] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0045] The embodiments of the present invention are provided to more completely describe the present invention to those skilled in the art of the present invention. The following embodiments can be modified into various other forms, and the scope of the present invention is not limited to the following embodiments. Rather, their embodiments are provided to make the disclosure of the present invention substantial and complete, and to fully convey the idea of ​​the present invention to those skilled in the art to which the present invention pertains.

[0046] In addition, in the following drawings, the thickness or size of each layer is exaggerated for convenience and clarity of description, and the same reference numerals are assigned to the same constituent elements in the drawings. As used in this specification, the term "and / or" includ...

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Abstract

The present invention relates to a heater assembly mounted on a soldering device for soldering a chip. The heater assembly according to one embodiment of the present invention comprises a heating plate, an electrically insulating main body and two or more bus bars; the heating plate includes a first outer peripheral surface and a second outer peripheral surface; the first outer peripheral surfacesupports a semiconductor structure to be processed in a contactable manner; the electrically insulating body is disposed on the second outer peripheral surface side of the heating plate and supports the heating plate; and the two or more bus bars are disposed between the heating plate and the electrically insulating main body, and is used for the heat release and power source application of the heating plate.

Description

【Technical field】 [0001] The present invention relates to a heater assembly, and more particularly, to a heater assembly capable of rapidly and accurately controlling temperature when manufacturing a semiconductor package. 【Background technique】 [0002] In general, high integration of semiconductor chips must be accompanied by miniaturization and high functionality of electronic products. Along with the high integration of semiconductor chips, semiconductor packages cannot be thinned and shortened only by conventional wire bonding methods. Therefore, recently, instead of using wire bonding, the semiconductor chip is bonded to a carrier such as a Substrates or wiring substrates with wiring substrates, and the method of performing wiring processes in other semiconductor chip stacking methods. As typical examples, there are flip-chip bonding techniques in which the above-mentioned semiconductor chips are bonded to a substrate in an inverted state, and three-dimensional lamin...

Claims

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Application Information

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IPC IPC(8): H05B3/20H01L21/67B23K3/047
CPCB23K3/047H01L21/67098H01L21/67109H05B3/20
Inventor 金学范柳道馨朴濬声李星珉金贤佚李政旭河正旻
Owner H&IRUJA有限公司
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