Dustproof heat dissipation structure for computer

Abstract

The invention discloses a dustproof heat dissipation structure for a computer, and relates to the technical field of computer heat dissipation. The dustproof heat dissipation structure comprises a computer case body, a water storage tank is fixed to the bottom of the computer case body, and a heat dissipation tank is fixed to the top of the computer case body; heat conduction cavities are formed in the inner walls of the two sides of the computer case, water absorption cotton layers are fixed to the inner walls of the heat conduction cavities, and water absorption cotton strips penetrating through the heat conduction cavities and the water storage tank and extending into the water storage tank are fixed to the water absorption cotton layers in the heat conduction cavities. The heat conduction cavities are formed in the computer case, and the heat dissipation box is arranged at the top of the computer case; the water storage tank and the absorbent cotton are matched for use, so that cooling water can be distributed on the surface of the computer case under the condition of no external force, heat emitted by a computer during working is absorbed by the water, energy is not consumed,dust is prevented from entering the computer case, the size is small, water resource consumption is low, the heat dissipation effect is good, and the use cost is low.

Description

technical field [0001] The invention belongs to the technical field of computer heat dissipation, and in particular relates to a dustproof and heat dissipation structure for a computer. Background technique [0002] The CPU and other components of the computer will generate heat during high-speed operation. Heat dissipation is actually a heat transfer process. The purpose is to transfer the heat generated by the CPU and other components to other media, and control the temperature of the CPU and other components at a stable temperature. within range. [0003] Most of the computer mainframes in the prior art are equipped with a cooling fan, but the cooling effect of the cooling fan still cannot meet the heat dissipation requirements, and it is easy to cause a large amount of dust to accumulate; the volume and weight of the water cooling are large, and the use cost is high, and the power consumption is high. The quantity is large, and the energy saving performance is poor. ...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a dust-proof and heat-dissipating structure for a computer, which quickly transfers the heat inside the computer out of the computer case by using heat exchange and water absorption and evaporation, without requiring additional power consumption, and the computer case is in a sealed state to avoid dust It solves the problem that the existing computer uses multiple fans to dissipate heat, and it is easy to enter the dust, and the water cooling is large in size, high in cost, and large in power consumption.

Images