Unlock instant, AI-driven research and patent intelligence for your innovation.

Testing method and testing system

A test method, a test system technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problem that takes a long time (for example, several weeks, or sometimes several months, the efficiency of the chip is reduced, etc. problem, to achieve the effect of improving efficiency and increasing coverage

Active Publication Date: 2020-06-05
REALTEK SEMICON CORP
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in existing approaches, test procedures take a considerable amount of time (eg, weeks, or sometimes months) to evaluate a certain number of defective devices in a wafer to obtain convincing diagnostic results
As a result, the efficiency of testing and manufacturing wafers will be reduced

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Testing method and testing system
  • Testing method and testing system
  • Testing method and testing system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The following will disclose multiple implementations of this case with diagrams. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the present case. That is to say, in some implementations of this case, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.

[0039] The terms "first", "second", etc. used herein do not specifically refer to the order or sequence, nor are they used to limit the present case, but are only used to distinguish elements or operations described with the same technical terms That's all. As used herein, the word "and / or" includes any combination of one or more of the associated listed items.

[0040] As used herein, "coupling" or "connection" can refer to...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A testing method is performed by at least one processor and includes the following operations of converting the first data associated with a scanning test into a program, wherein the program is configured to observe an untested part of a circuitry system that is unable to be tested in the scanning test; performing circuit simulations with the program according to a netlist file corresponding to the circuitry system and the testing patterns, and evaluating the testing patterns to generate the second data; selecting at least one candidate testing pattern from the testing patterns according to the second data; and performing at least one fault simulation on the circuitry system according to the netlist file and the at least one candidate testing pattern so as to test the circuitry system.

Description

technical field [0001] This case relates to a testing method and system, and in particular to a testing method and system for testing integrated circuits. Background technique [0002] Various testing methods for testing integrated circuits in wafers have been developed. However, in existing approaches, test procedures take a considerable amount of time (eg, weeks, or sometimes months) to evaluate a certain number of defective devices in a wafer to obtain convincing diagnostic results. As a result, the efficiency of testing and manufacturing wafers will be reduced. Contents of the invention [0003] In order to solve the above problems, some aspects of the present application provide a test method, which is executed by at least one processor and includes the following operations: converting a first data associated with a scan test into a program, wherein the program is used to observe a An untested portion of a circuit system that has not been verified in the scan test; ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/367
CPCG06F30/33G06F2119/02G01R31/318364G01R31/318547G01R31/31813G06F11/261
Inventor 陈志通叶懿德郑嘉贤吴倚彰阎怀玉
Owner REALTEK SEMICON CORP