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A fully automatic circuit board placement production line

A board patching, fully automatic technology, applied in the direction of electrical components, electrical components, etc., can solve the problems affecting the quality of circuit board production, waste of raw materials, circuit board sliding, etc., to facilitate clamping operations, improve pass rate, prevent shaking effect

Active Publication Date: 2021-02-23
长电(深圳)自动化设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a fully automatic circuit board placement production line, which has the advantage of being fixed and stable, and solves the problem that the existing printed circuit boards are prone to slipping during the placement process. The resulting patch failure not only wastes raw materials, but also affects the quality of circuit board production.

Method used

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  • A fully automatic circuit board placement production line
  • A fully automatic circuit board placement production line

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see Figure 1-2 , a fully automatic circuit board placement production line, comprising a conveying plate 1, an adjustment box 2, a fixed plate 3, a driving motor 4, a first movable rod 6, a rotating shaft 7, a second movable rod 8, and a clamping plate 10, The adjustment box 2 is arranged on the top of the conveying plate 1, the fixed plate 3 is fixedly connected to one side of the inner wall of the adjustment box 2, and the drive motor 4 is fixedly co...

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Abstract

The invention relates to the technical field of circuit board production, in particular to a full-automatic circuit board patch production line which comprises a conveying plate, an adjusting box, a fixed plate, a driving motor, a first movable rod, a rotating shaft, a second movable rod and a clamping plate. The adjusting box is arranged at the top of the conveying plate, the fixing plate is fixedly connected to one side of the inner wall of the adjusting box, the driving motor is fixedly connected to the inner wall of the adjusting box, an output shaft of the driving motor is fixedly connected with a rotating shaft through a coupler, and one end of the rotating shaft penetrates through and extends to the bottom of the front face of the fixing plate. A first movable rod and a second movable rod relatively move, then two clamping plates relatively move through a connecting rod, four corners of a circuit board are clamped, the structure is simple, the operation is convenient, the firmness of fixing the circuit board is ensured, the occurrence of shaking instability during chip mounting operation is prevented, and the percent of pass of products is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a fully automatic circuit board patch production line. Background technique [0002] The circuit board is also called printed circuit board and printed circuit board. It is the support body of electronic components and the provider of electrical connection of electronic components. Manufactured circuit boards need to use electronic circuit surface assembly technology, called surface mount or surface mount technology, to meet the needs of different functional circuit boards. Electronic circuit surface assembly technology, also known as surface mount or surface mount technology, is a method of mounting non-pin or short-lead surface mount components on the surface of a printed circuit board or other substrates. The circuit assembly and connection technology of soldering and assembly by soldering or dip soldering, etc. This technology makes the printed circuit board...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/00
CPCH05K13/0069
Inventor 兰信庭
Owner 长电(深圳)自动化设备有限公司