High-low temperature incubator for batch test of semiconductor chips

Abstract

The invention discloses a high-low temperature incubator for batch test of semiconductor chips, which comprises at least one layer of testing plate with a plurality of slots inserted into a semiconductor chip to be tested, a heat exchanger arranged in the inner wall of the incubator and used for gas heat exchange, a gas power device used for pressurizing gas, an air duct communicated with an air outlet of the gas power device, and air guide boxes corresponding to the testing plates on each layer respectively, the air inlet of each air guide box is communicated with the air channel, and each air guide box is internally provided with a plurality of spray holes facing the corresponding testing plates. According to the high-low temperature incubator for batch test of the semiconductor chips, the air duct is arranged at the air outlet of the air power device, so that a stable environment temperature is provided for the semiconductor chips to be tested on the testing plates in the incubator.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip testing, in particular to a high-low temperature incubator for batch testing of semiconductor chips. Background technique [0002] When conducting batch testing of semiconductor chips, in order to eliminate the test error caused by the temperature difference of the chip itself, it is necessary to ensure that the ambient temperature of each chip during the test of each batch of semiconductor chips is kept within a certain range, so a special high Low temperature oven to provide a stable temperature environment. In addition, due to the self-heating of the semiconductor chip, it is necessary to continuously remove the heat emitted by the semiconductor chip through ventilation, so as to keep the temperature of all chips within a certain range. [0003] Semiconductor chip test board such as figure 1 As shown, a plurality of sockets (sockets) are placed on the test board, and the sockets ar...

AI Technical Summary

Problems solved by technology

Since the semiconductor chip is located inside the slot, when the multi-layer test boards are stacked, the air outlet position and shape of the traditional high and low temperature box are limited, so the air direction in the oven cannot be parallel to that of multiple stacked test boards. It is difficult for the wind to blow directly to the surface of the chip

When the semiconductor chip is tested, its self-heating will affect the temperature of the air flowing through it, and because multiple semiconductor chips are arranged in an array, the air flowing through the upstream of the air duct will be heated by the heat of the semiconductor chip itself and then flow through the downstream slot. It will cause the air temperature in the upstream and downstream of the air duct to be different, which cannot meet the cooling requirements of semiconductor chips, and cannot guarantee that the ambient temperature of all semiconductor chips is the same.

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