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Mute type computer heat dissipation device special for computer

A heat dissipation device and computer technology, applied in computing, parts of pumping devices for elastic fluids, machines/engines, etc., can solve the problems of no circulating heat exchange mechanism and low heat exchange effect, and improve user comfort performance, good heat dissipation, and achieve the effect of quiet work

Inactive Publication Date: 2020-06-16
天津华融金服科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The computer case with silent heat dissipation device has the following disadvantages: the application only uses the semiconductor refrigeration sheet for heat exchange and cooling, and there is no good circulation heat exchange mechanism, so that the heat exchange effect is low

Method used

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  • Mute type computer heat dissipation device special for computer
  • Mute type computer heat dissipation device special for computer
  • Mute type computer heat dissipation device special for computer

Examples

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Embodiment Construction

[0020] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0021] Such as Figure 1-4 As shown, a computer-specific silent computer cooling device includes an upper oil box 1, a lower oil box 15, a disc-shaped copper tube 2, a first oil pump 5, and a semiconductor cooling chip 14. The bottom of the upper oil box 1 is provided with a disc Shaped copper pipe 2, the bottom of the disc-shaped copper pipe 2 is provided with a lower oil box 15, the bottom side of the upper oil box 1 is equipped with the first installation box 3 through bolts, and the top side of the lower oil box 15 is installed with bolts A second installation box 4 is installed, the first oil pump 5 is installed through bolts in the first installation box 3, the second oil pump 6 is installed in the second installation box 4, the discharge en...

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Abstract

The invention discloses a mute type computer heat dissipation device special for a computer. The device comprises an oil feeding box, an oil discharge box, a disc-shaped copper pipe, a first oil pumpand a semiconductor chilling plate, a disc-shaped copper pipe is arranged at the bottom of the oil feeding box; the oil discharge box is arranged at the bottom of the disc-shaped copper pipe; a firstmounting box is mounted on one side of the bottom of the oil feeding box through a bolt; a second mounting box is mounted on one side of the top of the oil discharge box through a bolt; a first oilpump is installed in the first installation box through bolts, a second oil pump is installed in the second installation box, the discharging end of the first oil pump is connected with the oil inletend of a disc-shaped copper pipe through an upper strip-shaped copper pipe, and the oil outlet end of the disc-shaped copper pipe is connected with a lower oil box through a lower strip-shaped copperpipe. Circulation of oil liquid is achieved, then good heat dissipation work is conducted on the computer case, silent work is achieved, noise pollution to a user is reduced, and use comfort is improved.

Description

technical field [0001] The invention relates to the technical field of computer cooling, in particular to a computer-specific silent computer cooling device. Background technique [0002] The current computer heat dissipation and cooling mostly use fans to blow and cool down, which will generate a lot of noise during use, which will affect the experience of personnel in use and affect personnel's listening to normal audio materials. [0003] Patent No. CN201720107522.0 discloses a computer case with a silent cooling device, one end of the telescopic tube is sleeved on the other end of the fixed tube, and can move axially along the fixed tube, and the installation cover is fixedly installed on the telescopic tube The other end; the structure design of the present invention is reasonable, adopts fanless heat dissipation design, utilizes the characteristics of semiconductor refrigeration sheet to absorb heat and release heat at the same time, quickly take away the heat on the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20F04B53/00
CPCF04B53/002G06F1/20
Inventor 任永正
Owner 天津华融金服科技有限公司
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