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sip module transfer device and sip module electromagnetic shielding system

A switching device and module technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of high cost, low efficiency, poor electromagnetic shielding performance, etc., to reduce costs, improve electromagnetic shielding performance and production efficiency. , to avoid the effect of poor electromagnetic shielding performance

Active Publication Date: 2020-11-20
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the object of the present invention is to provide a SIP module adapter device and a SIP module electromagnetic shielding system to alleviate the technical problems of poor electromagnetic shielding performance, high cost and low efficiency in the prior art

Method used

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  • sip module transfer device and sip module electromagnetic shielding system
  • sip module transfer device and sip module electromagnetic shielding system
  • sip module transfer device and sip module electromagnetic shielding system

Examples

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Embodiment 1

[0039] like Figure 1 to Figure 6 As shown, the embodiment of the present invention provides a SIP module transfer device, including a transfer layer 1 and a transfer box 8, and the transfer box 8 and the transfer layer 1 are formed to accommodate IC packaging devices 5 IC package device placement area; it should be pointed out that from figure 1 It can be seen that the above-mentioned transition layer forms the bottom layer of the transition box, in other words, the transition layer serves as the bottom layer of the transition box; IC packaging device 5 is packaged with chip 6;

[0040] Wherein, the inner surface or the outer surface of the transition box 8 is provided with an electromagnetic shielding layer; the transition box 8 includes a movable side wall 3 that can be opened and closed, that is, the movable side wall 3 can be opened and closed; the IC packaging device 5 Place in the IC packaging device placement area through the movable side wall 3; when the movable side...

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Abstract

The invention provides a SIP module transfer device and a SIP module electromagnetic shielding system, which relate to the field of semiconductors, wherein the SIP module transfer device includes a transfer box and a transfer layer, and the transfer box and the transfer layer surround An IC packaging device placement area for accommodating IC packaging devices is formed; an electromagnetic shielding layer is provided on the inner or outer side of the transfer box; the transfer box includes a movable side wall that can be opened and closed; the transfer layer is provided with elastic contacts point and the groove corresponding to the position of the elastic contact; the elastic contact is connected to the device pin of the IC package device; the bottom of the transfer layer is provided with a solder ball pin. The device can replace the existing metal sputtering process and laser slotting process in the production process of the existing SIP module, avoiding the poor electromagnetic shielding performance and low production efficiency caused by the metal sputtering process and laser slotting process. Due to the problem of high cost, the electromagnetic shielding performance and production efficiency are improved, and the cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a SIP module switching device and a SIP module electromagnetic shielding system. Background technique [0002] With the rapid development of the semiconductor industry, the packaging requirements for integrated circuits are more stringent. This is because the packaging technology is related to the functionality of the product. When the frequency of the IC exceeds 100MHz, electronic products are used for high-frequency signals in the communication field, so the product needs to have an electromagnetic shielding structure to prevent electromagnetic interference generated by various chips and components. Due to the occurrence of interference, most of today's high-pin-count chips (such as graphics chips and chipsets, etc.) have turned to SIP module electromagnetic packaging technology, and the SIP module structure includes a mix of BGA&QFN&LGA packaging forms. SIP module elec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552H01L23/043H01L23/367
CPCH01L23/552H01L23/043H01L23/367H01L2224/16227H01L2924/3025H01L2924/15311
Inventor 钟磊李利
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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