Process for preventing anodic oxidation deformation of plugging pin jacking plate of DaVinci test socket

Abstract

The invention discloses a process for preventing the anodic oxidation deformation of the plugging pin jacking plate of a DaVinci test socket. The process is characterized by comprising the following steps that: margins are reserved around the plugging pin jacking plate before anodic oxidation so as to form a reinforced frame; a groove is processed along the outline of a product on a surface whichis finally reserved to form the product; margins outside the groove and in a thickness direction form the reinforced frame; anodic oxidation treatment is carried out on the plugging pin jacking plate;the plugging pin jacking plate is connected with a positive electrode, a liquid in an oxidation tank is connected with a negative electrode, and electrification is performed for 90-120 minutes, so that t an aluminum oxide film layer with the thickness of 40-60 microns can be formed on the surface of the negative electrode; the product is put into a drying oven, and is kept under 175 DEG C for 2-3hours; finally, the plugging pin jacking plate is cut off, and the reinforced frame is reserved. With the process adopted, the change of the shape and position of a small hole can be effectively reduced or avoided, the quality stability of the product in a technical process can be ensured, the first-pass yield of the product is increased, and production cost is reduced. The process is suitable for batch production.

Description

technical field [0001] The invention relates to the field of anodic oxidation, in particular to a process for preventing the anodic oxidation deformation of a pin top plate of a da Vinci test socket. Background technique [0002] In the field of IC testing, compared with the traditional use of composite plastics to make spring probe sockets, aluminum alloy is used as the base of the product, and then through partial or overall anodic oxidation treatment, using the good conductivity of aluminum alloy itself and the insulation of aluminum oxide Accurately fulfilling the requirements of the test process for equipment functions can avoid the loss of test frequency and improve the accuracy of test data; but at the same time, affected by the structure of the pin top plate itself and the heat deformation during the anodic oxidation process, the number of holes on the pin top plate is large and closely arranged, requiring The surface area of ​​the anodizing treatment is large, and t...

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Problems solved by technology

[0002] In the field of IC testing, compared with the traditional use of composite plastics to make spring probe sockets, aluminum alloy is used as the base of the product, and then through partial or overall anodic oxidation treatment, using the good conductivity of aluminum alloy itself and the insulation of aluminum oxide Accurately fulfilling the requirements of the test process for equipment functions can avoid the loss of test frequency and improve the accuracy of test data; but at the same time, affected by the structure of the pin top plate itself and the heat deformation during the anodic oxidation process, the number of holes on the pin top plate is large and closely arranged, requiring The surface area of ​​anodic oxidation treatment is large, and the heat generated during the anodic oxidation treatment is large, which easily leads to product deformation. The processing method of the prior art cannot guarantee the high requirement of hole position accuracy

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