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Packaging method

A packaging method and wafer technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as damage and failure of sensitive components, and achieve the effect of avoiding damage and avoiding residues

Active Publication Date: 2022-07-05
厦门通富微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For chips with sensitive components, plasma physical impact treatment will cause damage to sensitive components and even lead to their failure.

Method used

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Embodiment Construction

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0028] see figure 1 and figure 2 , figure 1 is a schematic flowchart of an embodiment of the packaging method of the present application, figure 2 Yes figure 1 The structure flow chart corresponding to the encapsulation method. In this embodiment, the encapsulation method includes:

[0029] S110 : providing a wafer 100 , the wafer 100 includes a wafer body 110 , pads 120 disposed on the same side of the wafer body 110 and all e...

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Abstract

The present application discloses a packaging method, which includes: providing a wafer, the wafer including a wafer body, pads disposed on the same side of the wafer body and all exposed, and sensitive components; forming a protective layer covering the sensitive components ; Form metal bumps electrically connected to the pad on the exposed pad; remove the protective layer. The packaging method provided by the present application can protect sensitive components and avoid damage to the sensitive components during the process of preparing metal bumps.

Description

technical field [0001] The present application relates to the technical field of semiconductor packaging, and in particular, to a packaging method. Background technique [0002] In the process of preparing bumps on the chip, since the material of the exposed pad is generally aluminum, the surface of the aluminum is easily oxidized to aluminum oxide in the air. Therefore, before the bump is formed on the pad, in order to ensure the subsequent bump and solder The bonding force between the pads must be subjected to a plasma physical impact treatment on the exposed pads to remove the oxide on the pads. [0003] For a chip with sensitive components, the plasma physical impact treatment will cause damage to the sensitive components, or even cause them to fail. SUMMARY OF THE INVENTION [0004] The main technical problem to be solved by the present application is to provide a packaging method, which can protect sensitive components and avoid damage to the sensitive components. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/11H01L2224/11009
Inventor 孙彬
Owner 厦门通富微电子有限公司