Full duplex communication device with high heat dissipation performance

A communication device, full-duplex technology, applied in the field of communication, can solve the problems of clutter radiation interference, signal interference aggravation, affecting operation stability and reliability, etc., to improve stability and reliability, and reduce mutual signal interference , Improve the effect of electromagnetic compatibility performance

Pending Publication Date: 2020-06-19
GUANGDONG KUANPU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The internal device layout of the existing full-duplex communication device is not very ideal. The device layout does not consider the heat generation factor, resulting in local overheating of the full-duplex communication device, and the heat cannot be discharged in time, which affects the stability and reliability of operation.
In addition, the signal processing process is easy to generate and be interfered by clutter radiation, and the unreasonable layout of the device will further aggravate the signal interference phenomenon, and the battery compatibility performance of the full-duplex communication device needs to be further improved

Method used

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  • Full duplex communication device with high heat dissipation performance
  • Full duplex communication device with high heat dissipation performance
  • Full duplex communication device with high heat dissipation performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] like Figure 1 to Figure 10 As shown, this embodiment is a full-duplex communication device with high heat dissipation performance, including:

[0057] A box body 6 with a box cavity;

[0058] A signal input port for signal input;

[0059] A signal receiving port for signal receiving;

[0060] A low frequency band processing module for amplifying and filtering low frequency band signals;

[0061] A high-frequency processing module for amplifying and filtering high-frequency signals;

[0062] A low-frequency antenna for transmitting low-frequency signals or receiving external low-frequency signals;

[0063] A high-frequency antenna for transmitting high-frequency signals or receiving external high-frequency signals;

[0064] and a power supply module for power supply;

[0065] Both the low frequency band processing module and the high frequency band processing module include a power amplifier circuit, a direct filter circuit and a transceiver switch circuit connect...

Embodiment 2

[0092] In this embodiment, a full-duplex communication device with high heat dissipation performance is described by taking the 30-500M band signal as an example, as shown in Figure 11 shown. The low-frequency band processing module processes 30-100M band signals, and the low-frequency band processing module processes 110-500M band signals. In the low-frequency band processing module, the power amplifier circuit is a 30-100M power amplifier circuit, and the straight-through filter circuit includes a straight-through branch and three low-pass filter branches; the three low-pass filter branches are respectively 30-45MHz low-pass filter branches , 45-70MHz low-pass filter branch and 70-100MHz low-pass filter branch. In the high-frequency band processing module, the power amplifier circuit is a 110-500M power amplifier circuit, and the straight-through filter circuit includes a straight-through branch and three low-pass filter branches; the three low-pass filter branches are res...

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PUM

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Abstract

The invention provides a full duplex communication device with high heat dissipation performance. The full duplex communication device is characterized by comprising a box body, a low frequency band processing module, a high frequency band processing module and a power supply module, the power supply module comprises a power supply module body and a substrate. The power amplification circuits of the low-frequency-band processing module and the high-frequency-band processing module are integrated into a power amplification module and are arranged on one side, far away from the power supply module body, of the substrate; the straight-through filter circuits, the transceiving switch circuits and the directional coupling circuits of the low-frequency-band processing module and the high-frequency-band processing module are respectively integrated into a low-frequency-band filter module and a high-frequency-band filter module and are arranged on one side, with the power supply module body, of the substrate; the power amplifier module is provided with power amplifier heat dissipation fins, the substrate is provided with power supply heat dissipation fins to form a heat dissipation area, and the substrate is provided with a fan cover assembly and ventilation holes. The communication device is high in heat dissipation performance, reasonable in circuit module distribution, good in electromagnetic compatibility, and good in operation stability and reliability.

Description

technical field [0001] The invention relates to the technical field of communication, and more specifically, relates to a full-duplex communication device with high heat dissipation performance. Background technique [0002] Full duplex (Full Duplex) is a term for communication transmission. Communication allows data to be transmitted simultaneously in two directions, which is equivalent to the combination of two simplex communication methods in capability. [0003] The internal device layout of the existing full-duplex communication device is not very ideal. The device layout does not consider the heat generation factor, resulting in local overheating of the full-duplex communication device, and the heat cannot be discharged in time, which affects the stability and reliability of operation. In addition, the signal processing process is easy to generate and be interfered by clutter radiation, and the unreasonable layout of devices will further aggravate the signal interfere...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L5/14H04Q1/02
CPCH04L5/14H04Q1/035
Inventor 程福强谭灵杰朱小军
Owner GUANGDONG KUANPU TECH CO LTD
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