A kind of tvs chip glass passivation screen printing screen plate and its process method

A technology of glass passivation and screen printing, which is applied to screen printing machines, printing machines, printing machines, etc., and can solve problems such as incomplete groove printing
CN111319345BActive Publication Date: 2021-05-14TIANJIN HUANXIN TECH DEV
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
TIANJIN HUANXIN TECH DEV
Publication Date
2021-05-14

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Abstract

The invention provides a glass passivation screen printing screen plate for TVS chips, which includes several channels, and the two channels intersect with each other to form effective areas of several regular hexagons, and any adjacent regular hexagons are single vertices connected, and any adjacent connected vertices of the three regular hexagons form an invalid area of ​​a regular triangle. The present invention also provides a process method for TVS chip glass passivation using the above-mentioned printing screen printing process. In the printing process, the incision of the printing direction of the scraper is any interior angle of any regular hexagon, and the printing of the scraper The direction is parallel to the center line of the inner corner, and the printing track of the scraper is a continuous straight line. A layer of glass paste is coated on a silicon wafer with grooves engraved on one side, and the coated glass paste is baked. Dry, sintered. The invention can effectively solve the problem of incomplete printing coating in the groove, so that the glass passivation layer in the groove can cover more comprehensively and protect more completely.
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Description

Technical field

[0001] The present invention belongs to the field of semiconductor devices, in particular to a TVS chip glass passivation screen printing screen and a process method thereof.Background technique

[0002] The glass passivation screen printing process has gradually replaced the previous electrophoresis, photoresistance, and blade method, widely applied to the semiconductor device printing field due to its long-scale cost, low cost, low organic solvent, and high safety factor. The glass passivation layer can not only improve the parameters of the semiconductor device, but also enhance the stability and reliability of the semiconductor device, but also provide good surface mechanical protection for the back proof process. The TVS (Transient Voltage Suppressor) chip is a highly used high-performance semiconductor circuit protection device in the current market. The printed inside of the existing scraper is cut from the edge of the TVS chip, because the TVS chip size graphic is ...

Claims

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