Array substrate, method for making the same, and display device
A technology of an array substrate and a manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as affecting the quality of display products, abnormal display products, and loose parts to be bound, etc. Achieve the effect of avoiding abnormal display and lighting X-Line, improving binding strength, and ensuring display quality
Active Publication Date: 2022-07-15
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0004] The purpose of the present invention is to provide an array substrate and its manufacturing method, and a display device, which are used to solve the problem of easy bending or pulling of the binding parts after they are bound on the binding pads. The parts to be bound are loose at the binding place, or are directly disconnected from the binding pad, which leads to abnormal display of the display product and seriously affects the quality of the display product
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[0030] In order to further illustrate the array substrate, the manufacturing method thereof, and the display device provided by the embodiments of the present invention, the following detailed description is given with reference to the accompanying drawings.
[0031] Based on the problems existing in the background technology, the inventors of the present invention have found through research that after the components to be bound are bound on the bonding pads, the components to be bound appear when the components to be bound are bent or pulled out. The reason for the problem of looseness at the bonding place or direct disconnection from the bonding pad is: the bonding strength between the adhesive used to bond the bonding pad and the component to be bonded and the bonding pad The reasons for the insufficient bonding strength include: the step difference generated by the bonding pad is low, which makes the contact area between the adhesive and the bonding pad smaller, which in t...
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The invention provides an array substrate, a manufacturing method thereof, and a display device, which relate to the field of display technology. open, causing the display product to display abnormally. The array substrate includes a binding area, a plurality of binding pads are arranged on the binding area, and the binding pads are used to bind the structure to be bound together through conductive glue; in the direction perpendicular to the substrate, each The height of the surface of each bonding pad facing away from the substrate is higher than the height of the surface of the first part facing away from the substrate, and the first part is the part of the array substrate located around the bonding pad; the surface of the bonding pad facing away from the substrate There is a first difference between the height of the first portion and the height of the surface of the first portion facing away from the substrate, the first difference being greater than a threshold value. The array substrate provided by the present invention is used to manufacture display products.
Description
technical field [0001] The present invention relates to the field of display technology, and in particular, to an array substrate, a manufacturing method thereof, and a display device. Background technique [0002] The chip-on-film packaging process has become an important packaging technology for the current popular full screen. When using this packaging technology for packaging, multiple bonding pads should be set in the bonding area of the substrate, and the components to be bonded are passed through the glue. The material is bonded on the bonding pad to realize the electrical connection between the substrate and the component to be bonded. [0003] However, the above-mentioned binding methods still have the following problems: after the parts to be bound are bound on the binding pads, when the parts to be bound are bent or pulled, the parts to be bound are prone to loosen at the binding place. Or it is directly disconnected from the bonding pad, resulting in abnormal ...
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IPC IPC(8): H01L23/485H01L27/12H01L21/60
CPCH01L23/4824H01L27/124H01L24/03H01L2224/0231H01L2224/02331H01L2224/02381H01L2224/73204H01L2224/29298
Inventor 刘弘王凤国武新国郭志轩田亮崔玉琳王海东冯宇马波杨越张东宋室成颜冬
Owner BOE TECH GRP CO LTD