A pressing device for circuit board production
A pressing device and circuit board technology, which is applied in the direction of circuit board tool positioning, printed circuit, printed circuit manufacturing, etc., can solve the problems of uneven cooling, increased manufacturing cost, and increased scrap rate, so as to improve product quality and reduce scrap , the effect of reducing energy loss
Active Publication Date: 2021-07-20
重庆深新捷电子科技有限公司
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Problems solved by technology
[0002] The circuit board is also called a circuit board or a PCB board. The circuit board needs to go through multiple steps in order to be formed during production, including cutting processing, pressing processing, inner layer circuit processing, outer layer circuit processing, electroplating processing and solder masking. Processing, etc., wherein the pressing process includes hot pressing and cold pressing, that is, first use hot pressing to make the substrate and copper foil can be effectively combined together, after hot pressing, use the feeding car to send the hot pressed board to The cold press cooling is carried out in the cold press table to avoid deformation and oxidation of the board under high temperature. However, when the existing pressing device cools the circuit board, it uses all-round air supply, which makes the cooling not uniform enough and wastes a lot of resources. In addition, it is easy to cause displacement during flattening, resulting in an increase in the scrap rate
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[0026] see Figure 1~6 , in an embodiment of the present invention, a pressing device for circuit board production includes a body 1, a hydraulic cylinder 3, and a pressing warehouse 6, wherein an organic base 2 is fixed above the body 1, and the base 2 A hydraulic cylinder 3 is fixed on the side, and the output end of the hydraulic cylinder 3 extends into the interior of the pressing chamber 6 to perform pressing processing on the circuit board. It is characterized in that it also includes a follow-up clamping mechanism 7, a feeding device 8 and the air supply column 10, the two air supply columns 10 are vertically and symmetrically fixed inside the pressing chamber 6, and are used to cool down the circuit board to realize cold pressing treatment;
[0027] The sliding sleeve on the air supply column 10 is provided with a sliding seat 12, and the sliding seat 12 is fixedly connected with the output end of the hydraulic cylinder 3 by a drive rod 13, so as to move up and down wi...
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The invention discloses a pressing device for circuit board production, which comprises a machine body, a hydraulic cylinder and a press chamber, wherein an organic base is fixed above the machine body, and a hydraulic cylinder is fixed on the side of the machine base. The output end of the cylinder extends into the interior of the pressing chamber, and also includes a follow-up clamping mechanism, a feeding device, and an air supply column. The two air supply columns are vertically and symmetrically fixed inside the pressing chamber for Cool down the circuit board to achieve cold pressure treatment; the sliding sleeve on the air supply column is provided with a sliding seat, and the sliding seat is fixedly connected to the output end of the hydraulic cylinder by a drive rod, so as to be carried out with the expansion and contraction of the hydraulic cylinder. Move up and down to change the air supply range of the air supply column for precise air supply; the feeding device at least includes a feeding seat capable of placing circuit boards; Fixed clamping reduces the possibility of scrapping the circuit board due to the movement of the feeding seat.
Description
technical field [0001] The invention specifically relates to the technical field of circuit board pressing, in particular to a pressing device for circuit board production. Background technique [0002] The circuit board is also called a circuit board or a PCB board. The circuit board needs to go through multiple steps in order to be formed during production, including cutting processing, pressing processing, inner layer circuit processing, outer layer circuit processing, electroplating processing and solder masking. Processing, etc., wherein the pressing process includes hot pressing and cold pressing, that is, first use hot pressing to make the substrate and copper foil can be effectively combined together, after hot pressing, use the feeding car to send the hot pressed board to The cold press cooling is carried out in the cold press table to avoid deformation and oxidation of the board under high temperature. However, when the existing pressing device cools the circuit bo...
Claims
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IPC IPC(8): H05K3/00H05K3/22H05K3/38
CPCH05K3/0008H05K3/22H05K3/38
Inventor 郭晓阳侯克淅张星曹福来
Owner 重庆深新捷电子科技有限公司