A high-precision chip welding method for an LED automatic crystal bonder

Abstract

The invention relates to a high-precision chip welding method for an LED full-automatic crystal-bonding machine. By improving the crystal-bonding bracket and the bracket fixture, the loading process of the crystal-bonding bracket is greatly improved, which is convenient for the staff to quickly load, and at the same time facilitates the staff from the bracket. Take out the crystal-bonding bracket from the fixture, and the bracket fixture can be quickly released by setting the compression spring, which is convenient for the staff to take out the crystal-bonding bracket from the bracket fixture, and the dust-proof tape set at the notch of the T-shaped chute can Effectively protect the T-shaped chute, so that the inside of the T-shaped chute is not easy to be affected by external debris, and it is not easy to affect the normal sliding of the slider and the connecting column. Finally, for the bracket fixture, the design of the connecting base and the connecting rod is hard and soft. Under the premise of ensuring that the main rod of the bracket and the cup of the bracket are relatively stable, the upper part of the main rod of the bracket and the cup of the bracket can be displaced in a small range within a controllable range, which is convenient for the reinforcement of the die-bonding bracket.

Description

technical field [0001] The invention relates to a high-precision chip welding method of an LED full-automatic crystal-bonding machine, in particular to a high-precision chip-welding method of an LED full-automatic crystal-bonding machine. Background technique [0002] Solid crystal is also known as Die Bond or chip loading. Die-bonding is the process of bonding the chip to the designated area of ​​the bracket through colloid (for LEDs, generally conductive glue or insulating glue), forming a thermal path or an electrical path, and providing conditions for subsequent wiring connections. The main working process of the machine is dispensing glue on the bottom frame (1), dotting the crystal-bonding glue inside the cup, loading the film into the T-shaped chute (2), putting the LED chip inside the dispensing cup, and the slider ( 3) Baking, put the solid crystal lamp cup in the oven and bake three steps, and the above three steps have been greatly automated. Under the control of...

AI Technical Summary

Problems solved by technology

[0004] Before using the crystal bonder for crystal bonding work, it is usually necessary for technicians to prepare in advance, including melting the adhesive and fitting the crystal bonding bracket equipment to the bracket fixture and installing the bracket fixture to the designated position of the crystal bonder. Fixed, waiting for the follow-up die-bonding work, once there is an error in the manual assembly of the die-bonding bracket, it will easily affect the accuracy of the subsequent die-bonding work and affect the normal die-bonding work

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