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Solder paste adhesive force detection equipment and detection method thereof

A testing equipment and adhesion technology, applied in measuring devices, instruments, and mechanical devices, etc., can solve the problems of potential hidden dangers in after-sales and maintenance, waste of laboratory resources, and high prices, and achieve fast and effective detection, compact structure, Easy-to-use effects

Inactive Publication Date: 2020-07-10
苏州华碧微科检测技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional method uses Chatillon viscosity tester for testing, but there are few suppliers of Chatillon viscosity tester, and there are potential hidden dangers in after-sales and maintenance
In addition, the Chatillon viscosity tester can only be used to measure the adhesion force, and the price is relatively high. If there is no test order, it will cause a waste of laboratory resources

Method used

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  • Solder paste adhesive force detection equipment and detection method thereof
  • Solder paste adhesive force detection equipment and detection method thereof

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0025] refer to Figure 1-2 , a detection device for solder paste adhesion, comprising a miniature control electronic universal testing machine 1 and a clamp housing 9, the clamp housing 9 of the miniature control electronic universal testing machine 1 is provided with a clamping mechanism, and the miniature control electronic universal testing machine 1 is provided with a clamping mechanism. Both ends of the bottom surface of the control electronic universal testing machine 1 are fixedly connected with a base 2, and a sample slide 8 is placed on the top surface of the base 2, and an inner cavity is provided inside the base 2, and the bottom wall of the inner cavity i...

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Abstract

The invention discloses a solder paste adhesive force detection equipment which comprises a micro-control electronic universal testing machine and a clamp shell. A clamping mechanism is arranged in the clamp shell of the micro-control electronic universal testing machine. Bases are fixedly connected to the two ends of the bottom surface of the micro-control electronic universal testing machine; asample glass slide is placed on the top surface of the base, an inner cavity is formed in the base, a hydraulic cylinder is fixedly mounted on the bottom wall of the inner cavity, an adsorption shellis fixedly mounted on the top wall of the inner cavity, a negative pressure shell is fixedly connected to the bottom surface of the adsorption shell, and the upper wall of the negative pressure shellis communicated with the bottom wall of the adsorption shell. The probe is prevented from falling off in the detection process, the position of the sample glass slide is prevented from moving when pressure is applied in the detection process, the adhesive force of the solder paste can be rapidly and effectively detected, the cost can be saved, the micro-control electronic universal testing machineis high in precision, convenient to operate and stable in performance, and the parameter range completely meets the standard requirements.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a detection device for the adhesion force of solder paste and a detection method thereof. Background technique [0002] Solder paste, English name solder paste, gray paste. Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0003] When testing solder paste for adhesion, the ability of the printed pattern of the solder paste to retain the probe in the paste is determined by measuring the force required to separate the probe from the solder paste. The traditional method uses Chatillon viscosity tester for testing, but there are few suppliers of Chatillon viscosity tester, and there are potential hidden dangers in after-sales and maintenance...

Claims

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Application Information

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IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 唐瑜潞
Owner 苏州华碧微科检测技术有限公司
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