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A kind of semiconductor package and manufacturing method thereof

A manufacturing method and packaging technology, which are applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components, etc., can solve the problems such as the difficulty of realizing the copper sheet bridging method, achieve a good solder layer effect, and improve production. The effect of efficiency

Active Publication Date: 2022-03-25
捷捷微电(上海)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the current package size smaller than 3.0×3.0mm, the copper bridging method is also difficult to realize because the distance between the pins is too small to exceed the production capacity of the copper cutting mold.

Method used

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  • A kind of semiconductor package and manufacturing method thereof
  • A kind of semiconductor package and manufacturing method thereof
  • A kind of semiconductor package and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0044] 1A to 1G A process flow diagram of the packaging process of this embodiment is shown, including:

[0045] Step 1, such as Figure 1A As shown, a lead frame 100 is provided, the lead frame 100 includes a lead frame outer region 110 and a plurality of chip package regions 120, the chip package regions 120 are located within the lead frame outer region 110, each of the chip packages The area 120 includes a chip carrier 130 and a plurality of pins 140 surrounding the chip carrier 130 . The lead frame dicing metal includes a first lead frame dicing metal 150 and a second lead frame dicing metal 160, the first lead frame dicing metal 150 extends in a first direction, and the second lead frame dicing metal 160 The metal 160 extends along a second direction perpendicular to the first direction, and the chip package area 120 is surrounded by the first lead frame dicing metal 150 and the second lead frame dicing metal 160 .

[0046] Step 2, such as Figure 1B As shown, a mesh...

no. 2 example

[0055] The difference between this embodiment and the first embodiment is that, in step 6, this embodiment uses a first cutting tool to cut through the first cutting tool from the back of the lead frame 100 along the first direction. The lead frame cuts the metal 150, and the first copper sheet frame cuts the metal 250 without cutting, so as to expose the side surface of the lead 140 of the lead frame 100; After the exposed side surface of the foot 140 is formed with tin or tin alloy, a second cutting tool is used to cut the metal 250 through the first copper sheet frame along the first direction from the back of the lead frame 100, and cut Penetrates the plastic body 400; the width of the second cutting tool is smaller than the width of the first cutting tool to prevent scraping off the tin formed on the pins 140 when cutting the first copper frame cutting metal 250 or tin alloys.

[0056] In this embodiment, by cutting the first lead frame dicing metal 150 and the first cop...

no. 3 example

[0058] The difference between this embodiment and the first embodiment is that in step 6, this embodiment uses a first cutting tool to cut through the second cutting tool from the back of the lead frame 100 along the second direction. The lead frame is cut through metal 160, and the second copper sheet frame is cut through metal 260 to expose the side surfaces of the leads 140 of the lead frame 100; After tin or tin alloy is formed on the exposed side of the foot 140, a second cutting tool is used to cut the metal 260 through the second copper sheet frame along the second direction from the back of the lead frame 100, and cut Penetrates the plastic body 400; the width of the second cutting tool is smaller than the width of the first cutting tool to prevent scraping off the tin formed on the pins 140 when cutting the first copper frame cutting metal 250 or tin alloys.

[0059] In this embodiment, by cutting the second lead frame dicing metal 160 and the second copper frame dic...

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PUM

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Abstract

The invention discloses a semiconductor package and a manufacturing method thereof, comprising: providing a lead frame and a mesh copper frame; attaching a chip to the lead frame; The chip frame is electrically connected to the lead frame, and the bonding pad of the chip is electrically connected to the pins surrounding the chip through the bonding copper sheet in the copper bonding area above it; forming a plastic package; along the lead from the back of the lead frame The frame scribe metal cuts at least partially the mold body to expose sides of the leads; forms tin or tin alloy on the exposed sides of the leads; and cuts the mold body into individual semiconductor packages. The present invention connects the bonding copper sheet of each chip with the metal of the copper sheet frame cutting line through the meshed copper sheet frame. When tin is formed on the side of the pin, the meshed copper sheet frame can be used as a conductive The path allows the pins to conduct electricity after being cut, which effectively improves the production efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor package and a manufacturing method thereof. Background technique [0002] The pins of traditional DFN are not exposed to the package body. In particular, the pin area of ​​some small DFN packages is very small. Due to the different thermal expansion coefficients of the product and the printed circuit board, it is easy to cause virtual soldering during soldering. The pins of the traditional DFN package are not tin-plated, and the effect of tin climbing during the soldering process is not obvious, which makes it difficult to inspect whether the soldering is good or not. Using the meshed copper sheet bridging process can be used as a path for conducting current after the pins of the substrate are separated, and the side of the pins is tinned during the electroplating process. Tin plating on the side of the pins can effectively solve the problems of low solder...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/495
CPCH01L23/4952H01L23/49537H01L21/4842
Inventor 黄健孙闫涛张朝志顾昀浦宋跃桦吴平丽樊君张丽娜虞翔
Owner 捷捷微电(上海)科技有限公司