Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Subunit, MAC array and bit width reconfigurable analog-digital hybrid in-memory calculation module

A hybrid computing and sub-unit technology, applied in the direction of analog/digital conversion, digital memory information, electrical components, etc., can solve the problems of the MAC array occupying a large area, limited application scenarios, reducing the analog-to-digital conversion speed, etc., to solve the input imbalance. Effect of Voltage Offset

Active Publication Date: 2020-07-17
REEXEN TECH CO LTD
View PDF5 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of the SRAM in paper 4 are: (1) Each 1-bit computing SRAM cell has 10 transistors
The scheme of the article adopts a maximum occupancy of 2 N -1 (N is the ADC resolution) step-based ramp-based ADC that converges reduces the speed of analog-to-digital conversion, resulting in lower computational throughput; (5) the input of the array uses an additional DAC circuit to convert the input data x in (Usually a feature map) Converting from a digital representation to an analog representation, the non-ideal nature of the DAC circuit results in more loss of precision as well as area and energy overhead
[0006] To sum up, in the calculation process of the neural network, the calculation unit for 1-bit multiplication in the MAC array in the prior art uses more transistors; the capacitor for storing the multiplication result for accumulation is in one-to-one correspondence with the storage unit, that is, the storage unit The number of capacitors is the same as the number of capacitors, and the capacitors are generally much larger than the SRAM unit, especially in the advanced process, which will cause the MAC array to occupy a large area; at the same time, there is unconditional drive of transistors in the multiply-add operation, resulting in poor computing energy efficiency. High; in addition, the high calculation error rate leads to limited applicable scenarios, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Subunit, MAC array and bit width reconfigurable analog-digital hybrid in-memory calculation module
  • Subunit, MAC array and bit width reconfigurable analog-digital hybrid in-memory calculation module
  • Subunit, MAC array and bit width reconfigurable analog-digital hybrid in-memory calculation module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0051] In order to make the object, principle, technical solution and advantages of the invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that, as described in the summary of the present invention, the specific embodiments described here are used to explain the present invention, not to limit the present invention.

[0052] It should be noted that the connection or positional relationship that can be determined according to the text or technical content of the manual is partially omitted or not all position change diagrams are drawn for the sake of simplicity of the drawing. It cannot be considered that there is no explanation for the position change diagram shown in the figure. For the sake of brevity, it will not be explained one by one in the specific explanation, and it will be explained in a unified manner here.

[0053] As a common application scenario,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a subunit for analog-digital hybrid in-memory calculation for 1-bit multiplication, where only nine transistors are required. On this basis, it is provided that a plurality ofsubunits share a calculation capacitor and the transistors to form one calculation unit, so that the number of the transistors averaged from the subunits is close to eight. Then an MAC array is provided for multiply-add calculation, and comprises a plurality of calculation units, and the subunits in each unit are activated in a time division multiplexing mode. Furthermore, a differential system of the MAC array is provided, and the fault-tolerant capability of calculation is improved. Furthermore, the invention provides an analog-digital hybrid operation module used in the memory, which digitalizes the parallel analog output of the MAC array and performs the operation in other digital domains. The analog-to-digital conversion module in the operation module makes full use of the capacitorof the MAC array, so that the area of the operation module can be reduced, and the operation error can also be reduced. Furthermore, the invention provides a method for saving the energy consumption of the analog-to-digital conversion module by fully utilizing the data sparsity.

Description

technical field [0001] The present invention relates to the field of modular-digital hybrid in-memory computing, and more specifically, relates to a subunit, a MAC array, and a modulus-digital hybrid in-memory computing module with reconfigurable bit width. Background technique [0002] Currently, emerging edge applications such as existing mobile and IoT require high energy efficiency and high computing speed per unit area. High energy efficiency means longer battery life, and high operation rate per unit area means reduced area at a specified operation rate, thereby reducing costs. Nowadays, feed-forward inference calculations in Deep Neural Network (DNN) are dominated by Multiply-And-Accumulate (MAC) calculations, which require high energy efficiency and low-area implementation of MAC calculations while reducing pending Data transfer volume. Traditional digital integrated circuit implementation of MAC has the advantages of strong anti-noise ability, high precision, good...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H03M1/46
CPCH03M1/462H03M1/468G11C11/54G11C11/41G06N3/04Y02D10/00G06N3/065G06F7/5443G11C7/1069G11C7/109G11C7/16
Inventor 杨闵昊刘洪杰阿隆索·莫尔加多尼尔·韦伯克里斯蒂安·恩茨
Owner REEXEN TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products