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Ultrasonic transducer preparation method, ultrasonic transducer and information acquisition element

A technology of ultrasonic transducers and electrodes, applied in piezoelectric devices/electrostrictive devices, electrical components, piezoelectric/electrostrictive/magnetostrictive devices, etc. Problems such as the influence of piezoelectric properties of electrical materials and the influence of piezoelectric materials of ultrasonic transducers, to achieve the effect of ensuring integrity and reducing interference factors

Inactive Publication Date: 2020-07-24
SHENZHEN GOODIX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above method for preparing the ultrasonic transducer, since the piezoelectric layer is prepared on the second electrode that has been patterned, the growth surface conditions of the piezoelectric material in the piezoelectric layer are different, which affects the growth of the piezoelectric material and makes the growth The crystal phase of the piezoelectric material is not uniform, and the piezoelectric performance of the piezoelectric material in the piezoelectric layer will be affected
Therefore, the piezoelectric performance of the piezoelectric material in the piezoelectric layer of the ultrasonic transducer prepared by this method is easily affected.

Method used

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  • Ultrasonic transducer preparation method, ultrasonic transducer and information acquisition element
  • Ultrasonic transducer preparation method, ultrasonic transducer and information acquisition element
  • Ultrasonic transducer preparation method, ultrasonic transducer and information acquisition element

Examples

Experimental program
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Effect test

Embodiment 1

[0053] In view of the deficiencies in the above technical solutions, Embodiment 1 of the present application provides a method for manufacturing an ultrasonic transducer, such as image 3 as shown, image 3 A schematic flow chart of an ultrasonic transducer manufacturing method provided in an embodiment of the present application, the ultrasonic transducer manufacturing method includes:

[0054] 301. Form a first electrode layer that has not been patterned on a carrier wafer.

[0055] like Figure 4 as shown, Figure 4 In the above, the direction from the carrier wafer 200 to the first electrode layer 2021 is taken as the upper direction, or the direction where the operating region is located may also be taken as the upper direction, of course, Figure 4 Just illustrative.

[0056] The carrier wafer is a structure used to carry the first electrode layer and subsequently formed on the first electrode layer. Optionally, the material constituting the carrier wafer (Carrier Wa...

Embodiment 2

[0095] Based on the ultrasonic transducer preparation method described in the first embodiment above, the second embodiment of the present application provides an ultrasonic transducer preparation method, and the ultrasonic transducer preparation method described in the second embodiment of the present application is described in the first embodiment On the basis of the above method, steps 306-312 are added. It should be noted that steps 306-312 are not all steps to be performed, but are optional steps on the basis of steps 301-305.

[0096] Optionally, as in Figure 13 As shown, in the method for manufacturing an ultrasonic transducer provided in Embodiment 2 of the present application, after steps 301-305, the method further includes step 306.

[0097] 306. Form a passivation protection layer on the second surface of the first electrode.

[0098] The second surface of the first electrode is the side of the first electrode away from the piezoelectric layer.

[0099] The val...

Embodiment 3

[0123] Based on the preparation method of the ultrasonic transducer described in the first embodiment above, combined with the preparation method of the ultrasonic transducer provided in the second embodiment of the present application, the third embodiment of the present application provides a preparation method of the ultrasonic transducer, and the third embodiment of the present application The described ultrasonic transducer preparation method is based on the method described in Example 1, and steps 313-320 are added. It should be noted that steps 313-320 are not all steps to be performed, and are all performed in steps 301-320. 305 based on optional steps.

[0124] Optionally, as in Figure 21 As shown, in the method for manufacturing an ultrasonic transducer provided in Embodiment 3 of the present application, after steps 301-305, the method further includes steps 313-316.

[0125] 313 . Form a fourth opening extending to the second electrode at a position where the pie...

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Abstract

The embodiment of the invention provides an ultrasonic transducer preparation method, an ultrasonic transducer and an information acquisition element. The ultrasonic transducer preparation method comprises: forming a first electrode layer which is not subjected to graphical processing on a slide glass wafer; forming a piezoelectric layer on the first surface of the first electrode layer; forming asecond electrode layer on the first surface of the piezoelectric layer, and performing graphical processing on the second electrode layer to form a second electrode; bonding a support vibrating diaphragm layer formed on the first surface of the second electrode with the first surface of a substrate layer, and removing the slide glass wafer; and performing graphical processing on the first electrode layer to form a first electrode. According to the scheme, on the premise of ensuring the integrity of the piezoelectric structure of the piezoelectric layer and ensuring that the piezoelectric property of the piezoelectric material in the piezoelectric layer is not affected, graphical processing is carried out on all areas of the double-sided electrode layer of the piezoelectric layer.

Description

technical field [0001] The embodiment of the present application relates to the field of electronic information technology, and in particular to a method for manufacturing an ultrasonic transducer, an ultrasonic transducer and an information collection component. Background technique [0002] The ultrasonic transducer is a device that converts sound energy and electrical energy. The piezoelectric material in the ultrasonic transducer can generate a voltage difference between the two ends when it is deformed. When there is a voltage difference between the two ends, the piezoelectric material can be deformed. . Using this characteristic of piezoelectric materials can realize the mutual conversion between mechanical vibration and alternating current. Ultrasonic transducers generally include a piezoelectric layer made of piezoelectric material, a first electrode disposed above the piezoelectric layer, and a second electrode disposed below the piezoelectric layer. [0003] Usua...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/312H01L41/047H01L41/083H01L41/09H10N30/072H10N30/20H10N30/50H10N30/87
CPCH10N30/875H10N30/50H10N30/2047H10N30/072
Inventor 王文轩沈健王红超纪登鑫
Owner SHENZHEN GOODIX TECH CO LTD