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Cleaning method of target material

A technology of target material and cleaning agent, applied in the cleaning method using liquid, cleaning method using gas flow, cleaning method and utensils, etc., can solve the problem of affecting the sputtering effect, scratches on the sputtering surface, and difficulty in guaranteeing the surface finish of the product and other problems to achieve the effect of improving the cleaning effect and improving the finish

Pending Publication Date: 2020-07-28
KONFOONG MATERIALS INTERNATIONAL CO LTD
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Problems solved by technology

At present, the conventional cleaning technology adopted seriously scratches the sputtering surface, and it is difficult to guarantee the smoothness of the product surface, which affects the sputtering effect

Method used

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  • Cleaning method of target material
  • Cleaning method of target material
  • Cleaning method of target material

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Embodiment Construction

[0024] At present, the conventional target cleaning technology, for example, manually wipes and cleans the target with a cleaning cloth, which is not only difficult to ensure the cleanliness, but also, the cleaning cloth produces friction on the surface of the product, which easily scratches the surface of the product and makes the surface of the target not smooth enough. Bright and clean, can not meet the requirements of the sputtering process.

[0025] In order to overcome the above-mentioned defects, the inventor conducted research and found that spraying a cleaning agent on the surface of the target material for cleaning does not generate friction during the cleaning process, which effectively solves the problem of surface scratches caused by the target material during the cleaning process. The smoothness of the target surface is improved; and the cleaning effect can be improved by adjusting various parameters during spraying.

[0026] In order to make the above objects, f...

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Abstract

A cleaning method of a target material comprises the following steps that the target material is provided; and spray cleaning is carried out on the target material. A cleaning agent is sprayed to thesurface of the target material to achieve cleaning, no friction is generated in the cleaning process, the problem that surface scratches are caused to the target material in the cleaning process is effectively solved, and the smoothness of the surface of the target material is improved. Furthermore, high-pressure gas can be sprayed to the surface of the target material, the cleaning agent is blownand dried, meanwhile, dirt is taken away, and therefore the cleaning effect is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for cleaning a target. Background technique [0002] In recent years, semiconductor technology has developed rapidly. With the miniaturization and miniaturization of semiconductor devices, the requirements for the size and quality of the coating film formed on the semiconductor chip are also getting higher and higher. As we all know, among the various coating methods currently used, the effect of sputtering coating is better than other coating methods, and the coating formed by sputtering coating is more uniform, strong and excellent in performance. [0003] The principle of sputtering coating is to bombard the target with accelerated ions, so that the components on the surface of the target are sputtered out in the form of atomic groups or ions, and deposited on the surface of the substrate to form a coating. During the sputtering coating process, o...

Claims

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Application Information

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IPC IPC(8): B08B3/02B08B5/02B08B13/00
CPCB08B3/022B08B5/023B08B13/00
Inventor 姚力军潘杰王学泽魏小林
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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