Sensor, manufacturing method thereof and electronic equipment

Abstract

The invention discloses a sensor, a manufacturing method thereof and electronic equipment. The sensor comprises a substrate, wherein a bonding pad and a first conductive structure are arranged in thesubstrate, the bonding pad and the first conductive structure are insulated and disconnected from each other, the surface of the bonding pad and the surface of the first conductive structure are partially exposed, and a heat conduction limiting groove electrically communicated with the bonding pad is further formed in one surface of the substrate; an integrated circuit chip which is arranged in the heat conduction limiting groove and is electrically conducted with the first conductive structure through a connecting wire; and a shielding structure, wherein the shielding structure wraps the integrated circuit chip. According to the technical scheme, interference of external electromagnetism on the chip can be shielded, and meanwhile the heat dissipation effect of the chip is improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a sensor, a manufacturing method thereof, and electronic equipment. Background technique [0002] As consumer electronics products such as mobile phones, watches, and earphones are developing toward "light, thin, short, and small", the development direction of their core components and sensors is also moving toward miniaturization and integration. The sensor generally includes an electrically conductive sensor chip and an integrated circuit chip. In related technologies, in order to shield the external electromagnetic interference on the integrated circuit chip, the method of covering the chip is usually used, but this method easily leads to poor heat dissipation of the chip. Thus affecting the performance of the sensor. [0003] The above content is only used to assist in understanding the technical solution of the present invention, and does not mean that the above content is ...

AI Technical Summary

Problems solved by technology

The sensor generally includes an electrically conductive sensor chip and an integrated circuit chip. In related technologies, in order to shield the external electromagnetic interference on the integrated circuit chip, the method of covering the chip is usually used, but this method easily leads to poor heat dissipation effect of the chip. thereby affecting the performance of the sensor

Images